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Moisture ingress into electronics enclosures under isothermal conditions

    Research output: Contribution to journal › Conference article › Research › peer-review

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    Abstract

    The number of electronics used in outdoor environment is constantly growing. The humidity causes about 19 % of all electronics failures and, especially, moisture increases these problems due to the ongoing process of miniaturization and lower power consumption of electronic components. Moisture loads are still not understood well by design engineers, therefore this field has become one of the bottlenecks in the electronics system design. The objective of this paper is to model moisture ingress into an electronics enclosure under isothermal conditions. The moisture diffusion model is based on a 1D quasi-steady state (QSS) approximation for Fick's second law. This QSS approach is also described with an electrical analogy which gives a fast tool in modelling of the moisture response. The same QSS method is applied to ambient water vapour variations. The obtained results are compared to an analytical solution and very good agreement is found.
    Original languageEnglish
    Article number030041
    JournalA I P Conference Proceedings Series
    Volume1738
    Number of pages5
    ISSN0094-243X
    DOIs
    Publication statusPublished - 2016
    Event13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015) - Rhodes, Greece
    Duration: 22 Sept 2015 → 28 Sept 2015
    http://icnaam.org/

    Conference

    Conference13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015)
    LocationRhodes,
    Country/TerritoryGreece
    Period22/09/2015 → 28/09/2015
    Internet address

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