Modeling of InP DHBTs in a Transferred-Substrate Technology with Diamond Heat Spreader

Tom Keinicke Johansen*, M. Hossain, R. Doerner, H. Yacoub, K. Nosaeva, T. Shivan, W. Heinrich, Viktor Krozer

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

This paper presents a compact model for InP DHBTs in a transferred-substrate technology with a diamond heat spreader. The heat spreading layer is introduced to effectively remove the generated heat from the InP DHBTs but will also have a non-negligible influence on the device characteristics. Thermal vias connecting individual collectors of the InP DHBTs to the heat spreading layer act like open-circuited stubs and the electromagnetic environment of the device access structure is modified by the promixity of the diamond layer. The proposed compact modeling approach includes a multiline TRL calibration procedure using on-wafer structures for a definition of reference planes for model extraction, 3D electromagnetic simulation based extraction of the extrinsic parasitic network associated with via transitions and device electrodes in the presence of the diamond heat-spreading layer and the extraction of the remaining parameters of a large-signal HBT model from multi-bias S-parameters and static characteristics. The compact model is verified using a 500 nm InP DHBT by comparison against measured S-parameters and associated transistor gains in the frequency range up to 220 GHz and large-signal measurements at 94 GHz under class-A operation.
Original languageEnglish
Title of host publicationProceedings of the 15th European Microwave Integrated Circuits Conference
PublisherIEEE
Publication date2021
Pages169-172
ISBN (Print)978-2-87487-060-6
DOIs
Publication statusPublished - 2021
Event15th European Microwave Integrated Circuits Conference - Jaarbeurs Exhibition and Convention Centre, Utrecht, Netherlands
Duration: 10 Jan 202115 Jan 2021

Conference

Conference15th European Microwave Integrated Circuits Conference
LocationJaarbeurs Exhibition and Convention Centre
CountryNetherlands
CityUtrecht
Period10/01/202115/01/2021
SeriesEumic 2020 - 2020 15th European Microwave Integrated Circuits Conference

Keywords

  • Compact modeling
  • Diamond
  • InP double heterojunction bipolar transistor (DHBT)
  • Millimeter-wave integrated circuits

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