Microstructure and hardness development in a copper-nickel diffusion gradient model system

Linus Daniel Leonhard Duchstein, Xiaodan Zhang, Niels Hansen

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Abstract

Cu has been electrolytically coated with Ni and subsequently deformed by rotary swaging up to a strain of ε=2 to create a chemical gradient at the interface of the two elements. The extend of this chemical intermixing has been investigated through Energy Dispersive X-ray (EDX) spectroscopy in the Scanning and Transmission Electron Microscope (SEM and TEM). The depth, in which intermixing takes place, is about 1μm from the interface. Because of the uniform deformation, the structure does not get elongated but rather uniformly reduced in size. Microindentation hardness measurement shows a hardness increase from 120 to 135kp/mm² in the Cu phase with increasing strain. After annealing at 200°C for up to 4h the hardness first decreases, but raises above the value for the highly strained sample. The experimental findings are discussed with emphasis on surface mechanical alloying as a process of both scientific and technological interest.
Original languageEnglish
Article number012022
JournalI O P Conference Series: Materials Science and Engineering
Volume89
Number of pages8
ISSN1757-8981
DOIs
Publication statusPublished - 2015
Event36th Risø International Symposium on Materials Science - DTU Risø Campus, Roskilde, Denmark
Duration: 7 Sep 201511 Sep 2015
Conference number: 36

Conference

Conference36th Risø International Symposium on Materials Science
Number36
LocationDTU Risø Campus
Country/TerritoryDenmark
CityRoskilde
Period07/09/201511/09/2015

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Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI. Published under licence by IOP Publishing Ltd

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