Microstructure and Electrical Properties of Fe,Cu Substituted (Co,Mn)3O4 Thin Films

Dagmara Szymczewska, Sebastian Molin, Peter Vang Hendriksen, Piotr Jasinski

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In this work, thin films (~1000 nm) of a pure MnCo2O4 spinel together with its partially substituted derivatives (MnCo1.6Cu0.2Fe0.2O4, MnCo1.6Cu0.4O4, MnCo1.6Fe0.4O4) were prepared by spray pyrolysis and were evaluated for electrical conductivity. Doping by Cu increases the electrical conductivity, whereas doping by Fe decreases the conductivity. For Cu containing samples, rapid grain growth occurs and these samples develop cracks due to a potentially too high thermal expansion coefficient mismatch to the support. Samples doped with both Cu and Fe show high electrical conductivity, normal grain growth and no cracks. By co-doping the Mn, Co spinel with both Cu and Fe, its properties can be tailored to reach a desired thermal expansion coefficient/electrical conductivity value.
Original languageEnglish
Article number185
Issue number7
Number of pages12
Publication statusPublished - 2017


  • Manganese cobalt spinel
  • High temperature protective coatings
  • Thin films
  • Electrical conductivity

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