Microstructure and chemical data of the thermoelectric ZnSb material after joining to metallic electrodes and heat treatment

Safdar Abbas Malik, Thanh Hung Le, Ngo Van Nong

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Abstract

The data presented in this article are related to the research article entitled: “Solder free joining as a highly effective method for making contact between thermoelectric materials and metallic electrodes” (Malik et al., 2017) [1]. This article presents microstructure obtained by scanning electron microscopy (SEM) and chemical analysis by energy dispersive X-ray spectroscopy (EDX) point measurements of the thermoelectric ZnSb legs after joining to metallic electrodes using solder (Zn-2Al) and free-soldering methods.
Original languageEnglish
JournalData in Brief
Volume15
Pages (from-to)97-101
ISSN2352-3409
DOIs
Publication statusPublished - 2017

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