Microstructure & Other Properties of Pulse-Plated Copper for Electroforming Applications

Peter Torben Tang; Jens Dahl Jensen; H.C. Dam; Per Møller

Microstructure & Other Properties of Pulse-Plated Copper for Electroforming Applications

Peter Torben Tang
, Jens Dahl Jensen
, H.C. Dam
, Per Møller

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Abstract

Microstructure, hardness, material distribution and current efficiency were studied for various pulse patterns (both direct current, on/off and pulse reverse plating) and different bath compositions of copper sulfate and sulfuric acid, with additions of chloride. The objective was to develop a reliable copper electroforming process to provide a fine-grained and hard (above HV 125) deposit with good micro- and macrothrowing power. Potential applications include solar cell panels, tools for micro injection molding and various microelectromechanical systems (MEMS).

Original language	English
Title of host publication	SUR/FIN 2002
Publisher	AESF
Publication date	2002
Publication status	Published - 2002
Event	SUR/FIN Manufacturing and Technology Conference 2002 - Chicago,IL, United States Duration: 5 Nov 2002 → …

Conference

Conference	SUR/FIN Manufacturing and Technology Conference 2002
Country/Territory	United States
City	Chicago,IL
Period	05/11/2002 → …
Sponsor	The National Association for Surface Finishing

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@inproceedings{282a84b5bf3a43ab907a90391aafb5c5,

title = "Microstructure \& Other Properties of Pulse-Plated Copper for Electroforming Applications",

abstract = "Microstructure, hardness, material distribution and current efficiency were studied for various pulse patterns (both direct current, on/off and pulse reverse plating) and different bath compositions of copper sulfate and sulfuric acid, with additions of chloride. The objective was to develop a reliable copper electroforming process to provide a fine-grained and hard (above HV 125) deposit with good micro- and macrothrowing power. Potential applications include solar cell panels, tools for micro injection molding and various microelectromechanical systems (MEMS).",

author = "Tang, \{Peter Torben\} and Jensen, \{Jens Dahl\} and H.C. Dam and Per M{\o}ller",

year = "2002",

language = "English",

booktitle = "SUR/FIN 2002",

publisher = "AESF",

note = "SUR/FIN Manufacturing and Technology Conference 2002, SUR/FIN 2002 ; Conference date: 05-11-2002",

}

TY - GEN

T1 - Microstructure & Other Properties of Pulse-Plated Copper for Electroforming Applications

AU - Tang, Peter Torben

AU - Jensen, Jens Dahl

AU - Dam, H.C.

AU - Møller, Per

PY - 2002

Y1 - 2002

N2 - Microstructure, hardness, material distribution and current efficiency were studied for various pulse patterns (both direct current, on/off and pulse reverse plating) and different bath compositions of copper sulfate and sulfuric acid, with additions of chloride. The objective was to develop a reliable copper electroforming process to provide a fine-grained and hard (above HV 125) deposit with good micro- and macrothrowing power. Potential applications include solar cell panels, tools for micro injection molding and various microelectromechanical systems (MEMS).

AB - Microstructure, hardness, material distribution and current efficiency were studied for various pulse patterns (both direct current, on/off and pulse reverse plating) and different bath compositions of copper sulfate and sulfuric acid, with additions of chloride. The objective was to develop a reliable copper electroforming process to provide a fine-grained and hard (above HV 125) deposit with good micro- and macrothrowing power. Potential applications include solar cell panels, tools for micro injection molding and various microelectromechanical systems (MEMS).

M3 - Article in proceedings

BT - SUR/FIN 2002

PB - AESF

T2 - SUR/FIN Manufacturing and Technology Conference 2002

Y2 - 5 November 2002

ER -

Microstructure & Other Properties of Pulse-Plated Copper for Electroforming Applications

Abstract

Conference

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