Microstructure, hardness, material distribution and current efficiency were studied for various pulse patterns (both direct current, on/off and pulse reverse plating) and different bath compositions of copper sulfate and sulfuric acid, with additions of chloride. The objective was to develop a reliable copper electroforming process to provide a fine-grained and hard (above HV 125) deposit with good micro- and macrothrowing power. Potential applications include solar cell panels, tools for micro injection molding and various microelectromechanical systems (MEMS).
|Title of host publication||SUR/FIN 2002|
|Publication status||Published - 2002|
|Event||SUR/FIN Manufacturing and Technology Conference 2002 - Chicago,IL, United States|
Duration: 5 Nov 2002 → …
|Conference||SUR/FIN Manufacturing and Technology Conference 2002|
|Period||05/11/2002 → …|
|Sponsor||The National Association for Surface Finishing|