Abstract
Microstructure, hardness, material distribution and current efficiency were studied for various pulse patterns (both direct current, on/off and pulse reverse plating) and different bath compositions of copper sulfate and sulfuric acid, with additions of chloride. The objective was to develop a reliable copper electroforming process to provide a fine-grained and hard (above HV 125) deposit with good micro- and macrothrowing power. Potential applications include solar cell panels, tools for micro injection molding and various microelectromechanical systems (MEMS).
Original language | English |
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Title of host publication | SUR/FIN 2002 |
Publisher | AESF |
Publication date | 2002 |
Publication status | Published - 2002 |
Event | SUR/FIN Manufacturing and Technology Conference 2002 - Chicago,IL, United States Duration: 5 Nov 2002 → … |
Conference
Conference | SUR/FIN Manufacturing and Technology Conference 2002 |
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Country/Territory | United States |
City | Chicago,IL |
Period | 05/11/2002 → … |
Sponsor | The National Association for Surface Finishing |