Microstructure & Other Properties of Pulse-Plated Copper for Electroforming Applications

Peter Torben Tang, Jens Dahl Jensen, H.C. Dam, Per Møller

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Abstract

    Microstructure, hardness, material distribution and current efficiency were studied for various pulse patterns (both direct current, on/off and pulse reverse plating) and different bath compositions of copper sulfate and sulfuric acid, with additions of chloride. The objective was to develop a reliable copper electroforming process to provide a fine-grained and hard (above HV 125) deposit with good micro- and macrothrowing power. Potential applications include solar cell panels, tools for micro injection molding and various microelectromechanical systems (MEMS).
    Original languageEnglish
    Title of host publicationSUR/FIN 2002
    PublisherAESF
    Publication date2002
    Publication statusPublished - 2002
    EventSUR/FIN Manufacturing and Technology Conference 2002 - Chicago,IL, United States
    Duration: 5 Nov 2002 → …

    Conference

    ConferenceSUR/FIN Manufacturing and Technology Conference 2002
    CountryUnited States
    CityChicago,IL
    Period05/11/2002 → …
    SponsorThe National Association for Surface Finishing

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