Microstructural and hardness gradients in Cu processed by high pressure surface rolling

Q. Y. He, X.-M. Zhu, Q. S. Mei, Chuanshi Hong, G. L. Wu, Xiaoxu Huang

Research output: Contribution to journalConference articleResearchpeer-review

275 Downloads (Pure)


The surface of an annealed Cu plate was processed by a high pressure surface rolling (HPSR) process. It is found that the deformed surface layer in the Cu plate after HPSR can be as thick as 2 mm and is characterized by a gradient microstructure, with grain sizes varying from the nanoscale in the topmost surface to the microscale in the bulk. The hardness varies from 1.37 GPa at the topmost surface to about 0.6 GPa in the coarse-grained matrix. The results of the investigation demonstrate that the HPSR process shows good potential for the generation of thick gradient microstructures on the surface of bulk metallic materials.
Original languageEnglish
Article number012025
JournalI O P Conference Series: Materials Science and Engineering
Issue number1
Number of pages6
Publication statusPublished - 2017
Event38th Risø International Symposium on Materials Science - Technical University of Denmark , Roskilde, Denmark
Duration: 4 Sep 20178 Sep 2017


Conference38th Risø International Symposium on Materials Science
LocationTechnical University of Denmark

Bibliographical note

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

Fingerprint Dive into the research topics of 'Microstructural and hardness gradients in Cu processed by high pressure surface rolling'. Together they form a unique fingerprint.

Cite this