Microprobe metrology for direct sheet resistance and mobility characterization

Peter Folmer Nielsen; Dirch Hjorth Petersen; Rong Lin; Ane Jensen; Henrik Hartmann Henrichsen; Lauge Gammelgaard; Daniel Kjær; Ole Hansen

doi:10.1109/IWJT.2012.6212819

Microprobe metrology for direct sheet resistance and mobility characterization

Peter Folmer Nielsen, Dirch Hjorth Petersen, Rong Lin, Ane Jensen, Henrik Hartmann Henrichsen, Lauge Gammelgaard, Daniel Kjær, Ole Hansen

Technical University of Denmark

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Abstract

The M4PP measurement technique has gained increased interest from the semiconductor industry for direct sheet resistance measurements on ultra thin layers and small structures/pads. Several fully automatic microRSP probing tools are today in use for in-line sheet resistance measurements on blanket and patterned wafers. Using the next generation of microRSP probing tools it will be possible to perform both sheet resistance, mobility and active carrier density measurements using the collinear M4PP. In this article we demonstrate the various techniques necessary to perform high quality measurements using the M4PP and present the technical progress made during the last few years.

Original language	English
Title of host publication	Proceedings of the 12th International Workshop on Junction Technology
Number of pages	6
Publication date	2012
DOIs	https://doi.org/10.1109/IWJT.2012.6212819
Publication status	Published - 2012
Event	12th International Workshop on Junction Technology - FuXuan Hotel, Fudan University, Shanghai, China Duration: 14 May 2012 → 15 May 2012 Conference number: 12th

Conference

Conference	12th International Workshop on Junction Technology
Number	12th
Location	FuXuan Hotel, Fudan University
Country/Territory	China
City	Shanghai
Period	14/05/2012 → 15/05/2012

Keywords

Accuracy
Loading
Probes

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10.1109/IWJT.2012.6212819

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title = "Microprobe metrology for direct sheet resistance and mobility characterization",

abstract = "The M4PP measurement technique has gained increased interest from the semiconductor industry for direct sheet resistance measurements on ultra thin layers and small structures/pads. Several fully automatic microRSP probing tools are today in use for in-line sheet resistance measurements on blanket and patterned wafers. Using the next generation of microRSP probing tools it will be possible to perform both sheet resistance, mobility and active carrier density measurements using the collinear M4PP. In this article we demonstrate the various techniques necessary to perform high quality measurements using the M4PP and present the technical progress made during the last few years.",

keywords = "Accuracy, Loading, Probes",

author = "Nielsen, {Peter Folmer} and Petersen, {Dirch Hjorth} and Rong Lin and Ane Jensen and Henrichsen, {Henrik Hartmann} and Lauge Gammelgaard and Daniel Kj{\ae}r and Ole Hansen",

year = "2012",

doi = "10.1109/IWJT.2012.6212819",

language = "English",

booktitle = "Proceedings of the 12th International Workshop on Junction Technology",

note = "12th International Workshop on Junction Technology, IWJT 2012 ; Conference date: 14-05-2012 Through 15-05-2012",

}

Nielsen, PF, Petersen, DH, Lin, R, Jensen, A, Henrichsen, HH, Gammelgaard, L, Kjær, D & Hansen, O 2012, Microprobe metrology for direct sheet resistance and mobility characterization. in Proceedings of the 12th International Workshop on Junction Technology. 12th International Workshop on Junction Technology, Shanghai, China, 14/05/2012. https://doi.org/10.1109/IWJT.2012.6212819

TY - GEN

T1 - Microprobe metrology for direct sheet resistance and mobility characterization

AU - Nielsen, Peter Folmer

AU - Petersen, Dirch Hjorth

AU - Lin, Rong

AU - Jensen, Ane

AU - Henrichsen, Henrik Hartmann

AU - Gammelgaard, Lauge

AU - Kjær, Daniel

AU - Hansen, Ole

N1 - Conference code: 12th

PY - 2012

Y1 - 2012

N2 - The M4PP measurement technique has gained increased interest from the semiconductor industry for direct sheet resistance measurements on ultra thin layers and small structures/pads. Several fully automatic microRSP probing tools are today in use for in-line sheet resistance measurements on blanket and patterned wafers. Using the next generation of microRSP probing tools it will be possible to perform both sheet resistance, mobility and active carrier density measurements using the collinear M4PP. In this article we demonstrate the various techniques necessary to perform high quality measurements using the M4PP and present the technical progress made during the last few years.

AB - The M4PP measurement technique has gained increased interest from the semiconductor industry for direct sheet resistance measurements on ultra thin layers and small structures/pads. Several fully automatic microRSP probing tools are today in use for in-line sheet resistance measurements on blanket and patterned wafers. Using the next generation of microRSP probing tools it will be possible to perform both sheet resistance, mobility and active carrier density measurements using the collinear M4PP. In this article we demonstrate the various techniques necessary to perform high quality measurements using the M4PP and present the technical progress made during the last few years.

KW - Accuracy

KW - Loading

KW - Probes

U2 - 10.1109/IWJT.2012.6212819

DO - 10.1109/IWJT.2012.6212819

M3 - Article in proceedings

BT - Proceedings of the 12th International Workshop on Junction Technology

T2 - 12th International Workshop on Junction Technology

Y2 - 14 May 2012 through 15 May 2012

ER -

Microprobe metrology for direct sheet resistance and mobility characterization

Abstract

Conference

Keywords

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