Microprobe metrology for direct sheet resistance and mobility characterization

Peter Folmer Nielsen, Dirch Hjorth Petersen, Rong Lin, Ane Jensen, Henrik Hartmann Henrichsen, Lauge Gammelgaard, Daniel Kjær, Ole Hansen

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review


The M4PP measurement technique has gained increased interest from the semiconductor industry for direct sheet resistance measurements on ultra thin layers and small structures/pads. Several fully automatic microRSP probing tools are today in use for in-line sheet resistance measurements on blanket and patterned wafers. Using the next generation of microRSP probing tools it will be possible to perform both sheet resistance, mobility and active carrier density measurements using the collinear M4PP. In this article we demonstrate the various techniques necessary to perform high quality measurements using the M4PP and present the technical progress made during the last few years.
Original languageEnglish
Title of host publicationProceedings of the 12th International Workshop on Junction Technology
Number of pages6
Publication date2012
Publication statusPublished - 2012
Event12th International Workshop on Junction Technology - FuXuan Hotel, Fudan University, Shanghai, China
Duration: 14 May 201215 May 2012
Conference number: 12th


Conference12th International Workshop on Junction Technology
LocationFuXuan Hotel, Fudan University


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