Micro-injection moulding simulation and manufacturing of polymer chips for acoustic separation

Komeil Saeedabadi*, Fabian Lickert, Mathias Ohlin, Henrik Bruus, Guido Tosello, Matteo Calaon

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsResearchpeer-review

Abstract

This abstract presents advancement in the design and manufacturing of a fully polymer-based micro-injection moulded acoustofluidic chip for acoustic blood plasma separation in diagnostic Point-of-Care platforms. In order to move from conventional glass chips to a whole-polymer platform, appropriate materials for micro-injection moulding (µIM) were considered.

Polymethyl methacrylate (PMMA) by LG IG 830 was selected as the primary µIM material. Our FEM modelling of particle acoustophoresis behaviour in the channels with the selected material yielded the channel dimensions with an acoustic resonance frequency of 1.26 MHz for a water-filled channel. The separation channel was designed to be of 150 µm height, 375 µm width and 36 mm length.

The design was simulated and optimized using injection moulding simulations and virtual design of experiment (DOE). After moulding the parts using the optimized process settings, the chips were then sealed off using a 175 µm thin foil of the same material and through UV-aided hot press process. The bonding strength of the chips were then characterized using delamination test.

A delamination pressure of 36 MPa ± 7 MPa was achieved for the optimal bonding parameters. Ultimately, the chips were examined in regards to their functionality. They first stood the leakage test with a maximum pressure value of 2 bar and showed no sign of leakage. Secondly, the chips were tested for acoustofluidic performance using polymer beads as cell model.

Ultimately, the acoustofluidic results were compared to FEM simulations with positive agreements.
Original languageEnglish
Title of host publicationEuropean Society for Precision Engineering and Nanotechnology, Conference Proceedings : 22nd International Conference and Exhibition, EUSPEN 2022
EditorsR.K. Leach , A. Akrofi-Ayesu , C. Nisbet, D. Phillips
Publishereuspen
Publication date2022
Pages323 - 326
ISBN (Electronic)978-199899911-8
Publication statusPublished - 2022
Event22nd International Conference of the European Society for Precision Engineering and Nanotechnology (euspen 22) - Geneva, Switzerland
Duration: 30 May 20223 Jun 2022

Conference

Conference22nd International Conference of the European Society for Precision Engineering and Nanotechnology (euspen 22)
Country/TerritorySwitzerland
CityGeneva
Period30/05/202203/06/2022

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