Micro Injection Moulding

Erik Michael Kjær; Bjørn B. Johansen; Hans H. Sørensen; Henrik Koblitz Rasmussen; Uffe Rolf Arlø

Micro Injection Moulding

Erik Michael Kjær
, Bjørn B. Johansen
, Hans H. Sørensen
, Henrik Koblitz Rasmussen
, Uffe Rolf Arlø

Technical University of Denmark

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Abstract

Microstructures were created in SiO2 wafers using RIE and KOH etching. The mould inserts was manufactured by Ni electroplating the wafers. Different types of microstructures were made in the mould; rows of quadratic columns, rows of pyramids and of pyramid stumps. The structures (from the SiO2 wafers) were replicated in the plastic part. Parts of Polypropylene (PP), Polycarbonate (PC) and Polyoxymethylene (POM) were produced. Though, the height of the PP pyramids was considerable smaller than the depth of the pyramids in the Ni mould and the walls of the PC pyramids tended to curve. Furthermore, a tail developed in the plastic part, located perpendicular to the melt front and behind the pyramid structure of the mould.

Original language	English
Title of host publication	Proceedings of the 1st euspen Topical Conference on the Fabrication and Metrology in Nanotechnology
Editors	Leonardo De Chiffre, Kim Carneiro
Volume	1
Publisher	IPL
Publication date	2000
Pages	259-267
Publication status	Published - 2000
Event	1st euspen Topical Conference on Fabrication and Metrology in Nanotechnology - Copenhagen, Denmark Duration: 28 May 2000 → 30 May 2000

Conference

Conference	1st euspen Topical Conference on Fabrication and Metrology in Nanotechnology
Country/Territory	Denmark
City	Copenhagen
Period	28/05/2000 → 30/05/2000

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title = "Micro Injection Moulding",

abstract = "Microstructures were created in SiO2 wafers using RIE and KOH etching. The mould inserts was manufactured by Ni electroplating the wafers. Different types of microstructures were made in the mould; rows of quadratic columns, rows of pyramids and of pyramid stumps. The structures (from the SiO2 wafers) were replicated in the plastic part. Parts of Polypropylene (PP), Polycarbonate (PC) and Polyoxymethylene (POM) were produced. Though, the height of the PP pyramids was considerable smaller than the depth of the pyramids in the Ni mould and the walls of the PC pyramids tended to curve. Furthermore, a tail developed in the plastic part, located perpendicular to the melt front and behind the pyramid structure of the mould.",

keywords = "Polymer Process",

author = "Kj{\ae}r, \{Erik Michael\} and Johansen, \{Bj{\o}rn B.\} and S{\o}rensen, \{Hans H.\} and Rasmussen, \{Henrik Koblitz\} and Arl{\o}, \{Uffe Rolf\}",

year = "2000",

language = "English",

volume = "1",

pages = "259--267",

editor = "\{Leonardo De Chiffre, Kim Carneiro\}",

booktitle = "Proceedings of the 1st euspen Topical Conference on the Fabrication and Metrology in Nanotechnology",

publisher = "IPL",

note = "1st euspen Topical Conference on Fabrication and Metrology in Nanotechnology ; Conference date: 28-05-2000 Through 30-05-2000",

}

Micro Injection Moulding. / Kjær, Erik Michael; Johansen, Bjørn B.; Sørensen, Hans H. et al.
Proceedings of the 1st euspen Topical Conference on the Fabrication and Metrology in Nanotechnology. ed. / Leonardo De Chiffre, Kim Carneiro. Vol. 1 IPL, 2000. p. 259-267.

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

TY - GEN

T1 - Micro Injection Moulding

AU - Kjær, Erik Michael

AU - Johansen, Bjørn B.

AU - Sørensen, Hans H.

AU - Rasmussen, Henrik Koblitz

AU - Arlø, Uffe Rolf

PY - 2000

Y1 - 2000

N2 - Microstructures were created in SiO2 wafers using RIE and KOH etching. The mould inserts was manufactured by Ni electroplating the wafers. Different types of microstructures were made in the mould; rows of quadratic columns, rows of pyramids and of pyramid stumps. The structures (from the SiO2 wafers) were replicated in the plastic part. Parts of Polypropylene (PP), Polycarbonate (PC) and Polyoxymethylene (POM) were produced. Though, the height of the PP pyramids was considerable smaller than the depth of the pyramids in the Ni mould and the walls of the PC pyramids tended to curve. Furthermore, a tail developed in the plastic part, located perpendicular to the melt front and behind the pyramid structure of the mould.

AB - Microstructures were created in SiO2 wafers using RIE and KOH etching. The mould inserts was manufactured by Ni electroplating the wafers. Different types of microstructures were made in the mould; rows of quadratic columns, rows of pyramids and of pyramid stumps. The structures (from the SiO2 wafers) were replicated in the plastic part. Parts of Polypropylene (PP), Polycarbonate (PC) and Polyoxymethylene (POM) were produced. Though, the height of the PP pyramids was considerable smaller than the depth of the pyramids in the Ni mould and the walls of the PC pyramids tended to curve. Furthermore, a tail developed in the plastic part, located perpendicular to the melt front and behind the pyramid structure of the mould.

KW - Polymer Process

M3 - Article in proceedings

VL - 1

SP - 259

EP - 267

BT - Proceedings of the 1st euspen Topical Conference on the Fabrication and Metrology in Nanotechnology

A2 - null, Leonardo De Chiffre, Kim Carneiro

PB - IPL

T2 - 1st euspen Topical Conference on Fabrication and Metrology in Nanotechnology

Y2 - 28 May 2000 through 30 May 2000

ER -

Micro Injection Moulding

Abstract

Conference

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