Micro Injection Moulding

Erik Michael Kjær, Bjørn B. Johansen, Hans H. Sørensen, Henrik Koblitz Rasmussen, Uffe Rolf Arlø

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review


    Microstructures were created in SiO2 wafers using RIE and KOH etching. The mould inserts was manufactured by Ni electroplating the wafers. Different types of microstructures were made in the mould; rows of quadratic columns, rows of pyramids and of pyramid stumps. The structures (from the SiO2 wafers) were replicated in the plastic part. Parts of Polypropylene (PP), Polycarbonate (PC) and Polyoxymethylene (POM) were produced. Though, the height of the PP pyramids was considerable smaller than the depth of the pyramids in the Ni mould and the walls of the PC pyramids tended to curve. Furthermore, a tail developed in the plastic part, located perpendicular to the melt front and behind the pyramid structure of the mould.
    Original languageEnglish
    Title of host publicationProceedings of the 1st euspen Topical Conference on the Fabrication and Metrology in Nanotechnology
    EditorsLeonardo De Chiffre, Kim Carneiro
    Publication date2000
    Publication statusPublished - 2000
    Event1st euspen Topical Conference on Fabrication and Metrology in Nanotechnology - Copenhagen, Denmark
    Duration: 28 May 200030 May 2000


    Conference1st euspen Topical Conference on Fabrication and Metrology in Nanotechnology


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