Microstructures were created in SiO2 wafers using RIE and KOH etching. The mould inserts was manufactured by Ni electroplating the wafers. Different types of microstructures were made in the mould; rows of quadratic columns, rows of pyramids and of pyramid stumps. The structures (from the SiO2 wafers) were replicated in the plastic part. Parts of Polypropylene (PP), Polycarbonate (PC) and Polyoxymethylene (POM) were produced. Though, the height of the PP pyramids was considerable smaller than the depth of the pyramids in the Ni mould and the walls of the PC pyramids tended to curve. Furthermore, a tail developed in the plastic part, located perpendicular to the melt front and behind the pyramid structure of the mould.
|Title of host publication||Proceedings of the 1st euspen Topical Conference on the Fabrication and Metrology in Nanotechnology|
|Editors||Leonardo De Chiffre, Kim Carneiro|
|Publication status||Published - 2000|
|Event||1st euspen Topical Conference on Fabrication and Metrology in Nanotechnology - Copenhagen, Denmark|
Duration: 28 May 2000 → 30 May 2000
|Conference||1st euspen Topical Conference on Fabrication and Metrology in Nanotechnology|
|Period||28/05/2000 → 30/05/2000|