Micro-fabrication of three dimensional pyrolysed carbon microelectrodes

Suhith Hemanth (Inventor), Stephan Sylvest Keller (Inventor), Claudia Caviglia (Inventor), Letizia Amato (Inventor)

    Research output: Patent

    221 Downloads (Pure)


    The present invention relates in one aspect to a method of producing a three-dimensional microscale patterned resist template for a pyrolysed carbon microelectrode structure by means of UV-lithography. Coating a planar substrate with an epoxy-based negative photoresist, such as an SU-8 photoresist; soft baking the photoresist layer; performing a full depth exposure with UV light through a first mask; performing a partial depth exposure with UV light through a second mask; wherein the full depth exposure and the partial depth exposure are aligned to ensure that the first and second latent images are connected to each other; post-exposure baking the photoresist layer; and developing the microscale patterned resist template as a free-standing structure of cross-linked resist with lateral hanging structures that are supported by vertical support structures at a free height above the substrate. The method is characterized by a soft baking temperature below 70 °C. Repetitive coating and partial depth exposure allows for the fabrication of multiple level laterally interconnected structures. Carbonization of the resist template provides truly three-dimensional carbon microelectrode structures.

    Original languageEnglish
    IPCG03F 7/ 38 A I
    Patent numberWO2017050808
    Filing date30/03/2017
    Country/TerritoryInternational Bureau of the World Intellectual Property Organization (WIPO)
    Priority date21/09/2015
    Priority numberEP20150186066
    Publication statusPublished - 30 Mar 2017


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