Abstract
The present invention relates in one aspect to a method of producing a three-dimensional microscale patterned resist template for a pyrolysed carbon microelectrode structure by means of UV-lithography. Coating a planar substrate with an epoxy-based negative photoresist, such as an SU-8 photoresist; soft baking the photoresist layer; performing a full depth exposure with UV light through a first mask; performing a partial depth exposure with UV light through a second mask; wherein the full depth exposure and the partial depth exposure are aligned to ensure that the first and second latent images are connected to each other; post-exposure baking the photoresist layer; and developing the microscale patterned resist template as a free-standing structure of cross-linked resist with lateral hanging structures that are supported by vertical support structures at a free height above the substrate. The method is characterized by a soft baking temperature below 70 °C. Repetitive coating and partial depth exposure allows for the fabrication of multiple level laterally interconnected structures. Carbonization of the resist template provides truly three-dimensional carbon microelectrode structures.
| Original language | English |
|---|---|
| IPC | G03F 7/ 38 A I |
| Patent number | WO2017050808 |
| Filing date | 30/03/2017 |
| Country/Territory | International Bureau of the World Intellectual Property Organization (WIPO) |
| Priority date | 21/09/2015 |
| Priority number | EP20150186066 |
| Publication status | Published - 30 Mar 2017 |