Abstract
Electronic device and method of monitoring an adhesive layer is disclosed, the method comprising obtaining sensor data comprising first sensor data from a first electrode pair associated with the adhesive layer; determining, based on the sensor data, a first parameter indicative of a first electrical property of the adhesive layer; determining, based on the sensor data, a second parameter indicative of a second electrical property of the adhesive layer; determining, based on the first parameter and the second parameter, an operating state of the adhesive layer; and outputting the operating state via an interface.
| Original language | English |
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| IPC | G01N 27/ 04 A I |
| Patent number | WO2024132072 |
| Filing date | 21/12/2023 |
| Country/Territory | International Bureau of the World Intellectual Property Organization (WIPO) |
| Priority date | 22/12/2022 |
| Priority number | DK2022PA70642 |
| Publication status | Published - 27 Jun 2024 |