Abstract
There is provided a method for producing a substrate suitable for supporting an elongated superconducting element, wherein one or more elongated strips of masking material are placed on a solid element (202) so as to form one or more exposed elongated areas being delimited on one or two sides by elongated strip of masking material, and placing filling material on the solid element so that each exposed elongated area within the one or more exposed elongated areas is covered by a portion of filling material (318a-c) where each portion of filling material also covers at least a portion of the adjacent elongated strip of masking material and subsequently removing the one or more elongated strips of masking material so as to form one or more corresponding undercut volumes, where each undercut volume within the one or more undercut volumes is formed along a portion of filling material and between the portion of filling material and the solid element. The method may further comprise placing buffer material (640) and or superconducting material (642, 644, 646)) on the substrate, so as to provide a superconducting structure (601) with reduced AC losses.
| Original language | English |
|---|---|
| IPC | H01L39/24 |
| Patent number | WO2015074665 |
| Filing date | 28/05/2015 |
| Country/Territory | International Bureau of the World Intellectual Property Organization (WIPO) |
| Priority date | 20/11/2013 |
| Priority number | EP20130193734 |
| Publication status | Published - 28 May 2015 |