Method for producing substrates for superconducting layers

Research output: Patent

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Abstract

There is provided a method for producing a substrate (600) suitable for supporting an elongated superconducting element, wherein, e.g., a deformation process is utilized in order to form disruptive strips in a layered solid element, and where etching is used to form undercut volumes (330, 332) between an upper layer (316) and a lower layer (303) of the layered solid element. Such relatively simple steps enable providing a substrate which may be turned into a superconducting structure, such as a superconducting tape, having reduced AC losses, since the undercut volumes (330, 332) may be useful for separating layers of material. In a further embodiment, there is placed a superconducting layer on top of the upper layer (316) and/or lower layer (303), so as to provide a superconducting structure with reduced AC losses.
Original languageEnglish
IPCH01L39/14; H01L39/24
Patent numberWO2013174380A1
Filing date28/11/2013
CountryInternational Bureau of the World Intellectual Property Organization (WIPO)
Publication statusPublished - 2013

Bibliographical note

Also registered as: DK2013050148, WO2013DK50148 20130517, EP20120168636 20120521

Cite this

Wulff, A. C. (2013). IPC No. H01L39/14; H01L39/24. Method for producing substrates for superconducting layers. (Patent No. WO2013174380A1).
Wulff, Anders Christian (Inventor). / Method for producing substrates for superconducting layers. IPC No.: H01L39/14; H01L39/24. Patent No.: WO2013174380A1. Nov 28, 2013.
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title = "Method for producing substrates for superconducting layers",
abstract = "There is provided a method for producing a substrate (600) suitable for supporting an elongated superconducting element, wherein, e.g., a deformation process is utilized in order to form disruptive strips in a layered solid element, and where etching is used to form undercut volumes (330, 332) between an upper layer (316) and a lower layer (303) of the layered solid element. Such relatively simple steps enable providing a substrate which may be turned into a superconducting structure, such as a superconducting tape, having reduced AC losses, since the undercut volumes (330, 332) may be useful for separating layers of material. In a further embodiment, there is placed a superconducting layer on top of the upper layer (316) and/or lower layer (303), so as to provide a superconducting structure with reduced AC losses.",
author = "Wulff, {Anders Christian}",
note = "Also registered as: DK2013050148, WO2013DK50148 20130517, EP20120168636 20120521; WO2013174380A1; H01L39/14; H01L39/24",
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language = "English",
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Wulff, AC Nov. 28 2013, Method for producing substrates for superconducting layers, Patent No. WO2013174380A1, IPC No. H01L39/14; H01L39/24.

Method for producing substrates for superconducting layers. / Wulff, Anders Christian (Inventor).

IPC No.: H01L39/14; H01L39/24. Patent No.: WO2013174380A1. Nov 28, 2013.

Research output: Patent

TY - PAT

T1 - Method for producing substrates for superconducting layers

AU - Wulff, Anders Christian

N1 - Also registered as: DK2013050148, WO2013DK50148 20130517, EP20120168636 20120521

PY - 2013

Y1 - 2013

N2 - There is provided a method for producing a substrate (600) suitable for supporting an elongated superconducting element, wherein, e.g., a deformation process is utilized in order to form disruptive strips in a layered solid element, and where etching is used to form undercut volumes (330, 332) between an upper layer (316) and a lower layer (303) of the layered solid element. Such relatively simple steps enable providing a substrate which may be turned into a superconducting structure, such as a superconducting tape, having reduced AC losses, since the undercut volumes (330, 332) may be useful for separating layers of material. In a further embodiment, there is placed a superconducting layer on top of the upper layer (316) and/or lower layer (303), so as to provide a superconducting structure with reduced AC losses.

AB - There is provided a method for producing a substrate (600) suitable for supporting an elongated superconducting element, wherein, e.g., a deformation process is utilized in order to form disruptive strips in a layered solid element, and where etching is used to form undercut volumes (330, 332) between an upper layer (316) and a lower layer (303) of the layered solid element. Such relatively simple steps enable providing a substrate which may be turned into a superconducting structure, such as a superconducting tape, having reduced AC losses, since the undercut volumes (330, 332) may be useful for separating layers of material. In a further embodiment, there is placed a superconducting layer on top of the upper layer (316) and/or lower layer (303), so as to provide a superconducting structure with reduced AC losses.

M3 - Patent

M1 - WO2013174380A1

Y2 - 2013/11/28

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