Metallization of high aspect ratio, out of plane structures

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    Abstract

    This work is dedicated to developing a novel three dimensional structure for electrochemical measurements in neuronal studies. The final prototype will allow not only for the study and culture on chip of neuronal cells, but also of brain tissue. The use of out-of-plane electrodes instead of planar ones increases the sensitivity of the system and increases the signal-to-noise ratio in the recorded signals, due to the higher availability of surface area. The main bottleneck of the out-of-plane electrode fabrication lies in the metallization process for transforming them into active electrodes, since the coverage of the side walls of almost vertical pillars is not trivial by standard processes in a clean room facility. This paper will discuss the different steps taken towards this goal and present the results that we have obtained so far.
    Original languageEnglish
    Title of host publication3rd International Workshop on Advances in sensors and Interfaces, 2009. IWASI 2009.
    PublisherIEEE
    Publication date2009
    ISBN (Print)978-1-4244-4708-4
    DOIs
    Publication statusPublished - 2009
    Event3rd International Workshop on Advances in sensors and Interfaces, 2009. - Trani, Italy
    Duration: 1 Jan 2009 → …

    Conference

    Conference3rd International Workshop on Advances in sensors and Interfaces, 2009.
    CityTrani, Italy
    Period01/01/2009 → …

    Bibliographical note

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