The present invention relates to a composition comprising encapsulated particles in a polymeric material. The composition comprises a continuous phase and a discontinuous phase incorporated therein, wherein the continuous phase comprises a first polymeric material and wherein the discontinuous phase comprises particles, said particles comprising a filler material and an encapsulating coating of a second polymeric material, wherein the backbones of the first and second polymeric materials are the same. The composition may be used in electroactive polymers (EAPs) in order to obtain mechanically invisible polymer coatings.
|IPC||C08J5/04, C08J5/22, C08K3/04, C08K3/08, H01B1/22, H01B1/24, H01L41/09|
|Country||International Bureau of the World Intellectual Property Organization (WIPO)|
|Publication status||Published - 3 Apr 2014|