Mathematical modelling of coupled heat and mass transport into an electronic enclosure

Zygimantas Staliulionis, Mirmasoud Jabbaribehnam, Jesper Henri Hattel

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

In contrast to high fidelity CFD codes which require higher computational effort/time, the well-known Resistor-Capacitor (RC) approach requires much lower calculation time, but also with a lower resolution of the geometrical arrangement. Therefore, for enclosures without too complex geometry in their interior, it is more efficient to use the RC method for thermal management and design of electronic compartments. Thus, the objective of this paper is to build an in-house code based on the RC approach for simulating coupled heat and mass transport into a (closed) electronic enclosure. The developed code has the capability of combining lumped components and a 1D description. Heat and mass transport is based on a FVM discretization of the heat conduction equation and Fick's second law. Simulation results are compared with corresponding experimental findings and good agreement is found. Second simulation was performed to study the response of temperature and moisture inside an enclosure exposed to the B2 STANAG climatic cyclic conditions.
Original languageEnglish
Title of host publicationProceedings of the 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2016
PublisherIEEE
Publication date2016
Pages323-326
ISBN (Print)978-1-5090-5450-3
ISBN (Electronic)978-1-5090-5451-0
DOIs
Publication statusPublished - 2016
Event22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2016 - Budapest, Hungary
Duration: 21 Sep 201623 Sep 2016

Conference

Conference22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2016
Country/TerritoryHungary
CityBudapest
Period21/09/201623/09/2016

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