TY - JOUR
T1 - Manufacturing of high strength and high conductivity copper with laser powder bed fusion
AU - Liu, Yingang
AU - Zhang, Jingqi
AU - Niu, Ranming
AU - Bayat, Mohamad
AU - Zhou, Ying
AU - Yin, Yu
AU - Tan, Qiyang
AU - Liu, Shiyang
AU - Hattel, Jesper Henri
AU - Li, Miaoquan
AU - Huang, Xiaoxu
AU - Cairney, Julie
AU - Chen, Yi-Sheng
AU - Easton, Mark
AU - Hutchinson, Christopher
AU - Zhang, Ming-Xing
PY - 2024
Y1 - 2024
N2 - Additive manufacturing (AM), known as 3D printing, enables rapid fabrication of geometrically complex copper (Cu) components for electrical conduction and heat management applications. However, pure Cu or Cu alloys produced by 3D printing often suffer from either low strength or low conductivity at room and elevated temperatures. Here, we demonstrate a design strategy for 3D printing of high strength, high conductivity Cu by uniformly dispersing a minor portion of lanthanum hexaboride (LaB6) nanoparticles in pure Cu through laser powder bed fusion (L-PBF). We show that trace additions of LaB6 to pure Cu results in an improved L-PBF processability, an enhanced strength, an improved thermal stability, all whilst maintaining a high conductivity. The presented strategy could expand the applicability of 3D printed Cu components to more demanding conditions where high strength, high conductivity and thermal stability are required.
AB - Additive manufacturing (AM), known as 3D printing, enables rapid fabrication of geometrically complex copper (Cu) components for electrical conduction and heat management applications. However, pure Cu or Cu alloys produced by 3D printing often suffer from either low strength or low conductivity at room and elevated temperatures. Here, we demonstrate a design strategy for 3D printing of high strength, high conductivity Cu by uniformly dispersing a minor portion of lanthanum hexaboride (LaB6) nanoparticles in pure Cu through laser powder bed fusion (L-PBF). We show that trace additions of LaB6 to pure Cu results in an improved L-PBF processability, an enhanced strength, an improved thermal stability, all whilst maintaining a high conductivity. The presented strategy could expand the applicability of 3D printed Cu components to more demanding conditions where high strength, high conductivity and thermal stability are required.
U2 - 10.1038/s41467-024-45732-y
DO - 10.1038/s41467-024-45732-y
M3 - Journal article
C2 - 38347023
SN - 2041-1723
VL - 15
JO - Nature Communications
JF - Nature Communications
IS - 1
M1 - 1283
ER -