Low Cost High Performance Zinc Antimonide Thin Films for Thermoelectric Applications

Ye Sun; Mogens Christensen; Simon Johnsen; Ngo Van Nong; Yi Ma; Michael Sillassen; Eryun Zhang; Anders E.C. Palmqvist; Jørgen Bøttiger; Bo B. Iversen

doi:10.1002/adma.201104947

Low Cost High Performance Zinc Antimonide Thin Films for Thermoelectric Applications

Ye Sun, Mogens Christensen, Simon Johnsen, Ngo Van Nong, Yi Ma, Michael Sillassen, Eryun Zhang, Anders E.C. Palmqvist, Jørgen Bøttiger, Bo B. Iversen

Department of Energy Conversion and Storage

Research output: Contribution to journal › Journal article › Research › peer-review

Abstract

Zinc antimonide thin films with high thermoelectric performance are produced by a simple sputtering method. The phase-pure Zn4Sb3 and ZnSb thin films fulfill the key requirements for commercial TE power generation: cheap elements, cheap fabrication method, high performance and thermal stability. In addition, two completely new meta-stable crystalline phases of zinc antimonide have been discovered.

Original language	English
Journal	Advanced Materials
Volume	24
Issue number	13
Pages (from-to)	1693-1696
ISSN	0935-9648
DOIs	https://doi.org/10.1002/adma.201104947
Publication status	Published - 2012

Keywords

Thermoelectrics
Thin films
Magnetron sputtering
Zinc antimonide
Thermal stability

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@article{69a4f62980ab4a8aa51b00f360817026,

title = "Low Cost High Performance Zinc Antimonide Thin Films for Thermoelectric Applications",

abstract = "Zinc antimonide thin films with high thermoelectric performance are produced by a simple sputtering method. The phase-pure Zn4Sb3 and ZnSb thin films fulfill the key requirements for commercial TE power generation: cheap elements, cheap fabrication method, high performance and thermal stability. In addition, two completely new meta-stable crystalline phases of zinc antimonide have been discovered.",

keywords = "Thermoelectrics, Thin films, Magnetron sputtering, Zinc antimonide, Thermal stability",

author = "Ye Sun and Mogens Christensen and Simon Johnsen and {Van Nong}, Ngo and Yi Ma and Michael Sillassen and Eryun Zhang and Palmqvist, {Anders E.C.} and J{\o}rgen B{\o}ttiger and Iversen, {Bo B.}",

year = "2012",

doi = "10.1002/adma.201104947",

language = "English",

volume = "24",

pages = "1693--1696",

journal = "Advanced Materials",

issn = "0935-9648",

publisher = "Wiley",

number = "13",

}

TY - JOUR

T1 - Low Cost High Performance Zinc Antimonide Thin Films for Thermoelectric Applications

AU - Sun, Ye

AU - Christensen, Mogens

AU - Johnsen, Simon

AU - Van Nong, Ngo

AU - Ma, Yi

AU - Sillassen, Michael

AU - Zhang, Eryun

AU - Palmqvist, Anders E.C.

AU - Bøttiger, Jørgen

AU - Iversen, Bo B.

PY - 2012

Y1 - 2012

N2 - Zinc antimonide thin films with high thermoelectric performance are produced by a simple sputtering method. The phase-pure Zn4Sb3 and ZnSb thin films fulfill the key requirements for commercial TE power generation: cheap elements, cheap fabrication method, high performance and thermal stability. In addition, two completely new meta-stable crystalline phases of zinc antimonide have been discovered.

AB - Zinc antimonide thin films with high thermoelectric performance are produced by a simple sputtering method. The phase-pure Zn4Sb3 and ZnSb thin films fulfill the key requirements for commercial TE power generation: cheap elements, cheap fabrication method, high performance and thermal stability. In addition, two completely new meta-stable crystalline phases of zinc antimonide have been discovered.

KW - Thermoelectrics

KW - Thin films

KW - Magnetron sputtering

KW - Zinc antimonide

KW - Thermal stability

U2 - 10.1002/adma.201104947

DO - 10.1002/adma.201104947

M3 - Journal article

SN - 0935-9648

VL - 24

SP - 1693

EP - 1696

JO - Advanced Materials

JF - Advanced Materials

IS - 13

ER -

Low Cost High Performance Zinc Antimonide Thin Films for Thermoelectric Applications

Abstract

Keywords

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