Abstract
Electrodeposited copper samples composed of columnar grains subdivided by alternating twin/matrix (T/M) lamellae have been cold rolled to 30-85% reduction in thickness. The thickness of the T/M lamellae varies over a wide range from a few nanometres to about 1 m. The deformation microstructure has been characterized systematically. In thin T/M lamellae (below 50-100 nm) the deformation behaviours differ significantly from that of thick T/M lamellae, as the dislocation activity is concentrated at the T/M boundaries illustrated by the observations of stacking faults and Shockley partial dislocations. In thick T/M lamellae (100-1000 nm), the deformation microstructure is related to the grain orientation as also observed previously in deformed single crystals and polycrystals with a grain size at the micrometre scale. The experiment therefore suggests that the universal structural characteristics of deformation microstructure can be extended one order of magnitude from about 5 m to the sub-micrometre scale (about 0.5 m). © 2014 Taylor & Francis.
Original language | English |
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Journal | Philosophical Magazine |
Volume | 94 |
Issue number | 20 |
Pages (from-to) | 2262-2280 |
ISSN | 1478-6435 |
DOIs | |
Publication status | Published - 2014 |
Keywords
- crystal orientation
- dislocation structures
- nanoscale
- TEM
- twin thickness
- Cold rolling
- Crystal orientation
- Metal cladding
- Microstructure
- Transmission electron microscopy
- Deformation behaviour
- Deformation microstructure
- Dislocation structures
- Electrodeposited copper
- Nano scale
- Shockley partial dislocations
- Structural characteristics
- Deformation