Length scale effect on the deformation microstructures of grown-in twins in copper

Qiuhong Lu, Manling Sui, Xiaoxu Huang, Douxing Li, Niels Hansen

    Research output: Contribution to journalJournal articleResearchpeer-review


    Electrodeposited copper samples composed of columnar grains subdivided by alternating twin/matrix (T/M) lamellae have been cold rolled to 30-85% reduction in thickness. The thickness of the T/M lamellae varies over a wide range from a few nanometres to about 1 m. The deformation microstructure has been characterized systematically. In thin T/M lamellae (below 50-100 nm) the deformation behaviours differ significantly from that of thick T/M lamellae, as the dislocation activity is concentrated at the T/M boundaries illustrated by the observations of stacking faults and Shockley partial dislocations. In thick T/M lamellae (100-1000 nm), the deformation microstructure is related to the grain orientation as also observed previously in deformed single crystals and polycrystals with a grain size at the micrometre scale. The experiment therefore suggests that the universal structural characteristics of deformation microstructure can be extended one order of magnitude from about 5 m to the sub-micrometre scale (about 0.5 m). © 2014 Taylor & Francis.
    Original languageEnglish
    JournalPhilosophical Magazine
    Issue number20
    Pages (from-to)2262-2280
    Publication statusPublished - 2014


    • crystal orientation
    • dislocation structures
    • nanoscale
    • TEM
    • twin thickness
    • Cold rolling
    • Crystal orientation
    • Metal cladding
    • Microstructure
    • Transmission electron microscopy
    • Deformation behaviour
    • Deformation microstructure
    • Dislocation structures
    • Electrodeposited copper
    • Nano scale
    • Shockley partial dislocations
    • Structural characteristics
    • Deformation


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