Length scale effect on the deformation microstructures of grown-in twins in copper

Qiuhong Lu, Manling Sui, Xiaoxu Huang, Douxing Li, Niels Hansen

Research output: Contribution to journalJournal articleResearchpeer-review

Abstract

Electrodeposited copper samples composed of columnar grains subdivided by alternating twin/matrix (T/M) lamellae have been cold rolled to 30-85% reduction in thickness. The thickness of the T/M lamellae varies over a wide range from a few nanometres to about 1 m. The deformation microstructure has been characterized systematically. In thin T/M lamellae (below 50-100 nm) the deformation behaviours differ significantly from that of thick T/M lamellae, as the dislocation activity is concentrated at the T/M boundaries illustrated by the observations of stacking faults and Shockley partial dislocations. In thick T/M lamellae (100-1000 nm), the deformation microstructure is related to the grain orientation as also observed previously in deformed single crystals and polycrystals with a grain size at the micrometre scale. The experiment therefore suggests that the universal structural characteristics of deformation microstructure can be extended one order of magnitude from about 5 m to the sub-micrometre scale (about 0.5 m). © 2014 Taylor & Francis.
Original languageEnglish
JournalPhilosophical Magazine
Volume94
Issue number20
Pages (from-to)2262-2280
ISSN1478-6435
DOIs
Publication statusPublished - 2014

Keywords

  • crystal orientation
  • dislocation structures
  • nanoscale
  • TEM
  • twin thickness
  • Cold rolling
  • Crystal orientation
  • Metal cladding
  • Microstructure
  • Transmission electron microscopy
  • Deformation behaviour
  • Deformation microstructure
  • Dislocation structures
  • Electrodeposited copper
  • Nano scale
  • Shockley partial dislocations
  • Structural characteristics
  • Deformation

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