Kinetics of thermal grooving during low temperature recrystallization of pure aluminum

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Abstract

The migration of a recrystallization boundary in pure aluminum was followed during in situ annealing in a scanning electron microscope. The microstructure was characterized using the electron channeling contrast technique, and a typical stop-go grain boundary motion was observed during annealing. Thermal grooving associated with boundary migration on the inspected free surface was characterized after the in-situ experiment using atomic force microscopy. The results show that new thermal grooves develop at places where the recrystallization boundary segments remain stationary for a relatively long time. The kinetics of thermal grooving are determined. Effects of the surface oxidation layer on the formation of thermal grooving as well as the overall influence of grooves on boundary migration are discussed. © (2013) Trans Tech Publications, Switzerland.
Original languageEnglish
JournalMaterials Science Forum
Volume753
Pages (from-to)117-120
ISSN0255-5476
DOIs
Publication statusPublished - 2013
Event5th International Conference on Recrystallization and Grain Growth - Sydney, Australia
Duration: 5 May 201310 May 2013

Conference

Conference5th International Conference on Recrystallization and Grain Growth
CountryAustralia
CitySydney
Period05/05/201310/05/2013

Keywords

  • Aluminum
  • Atomic force microscopy
  • Grain boundaries
  • Grain growth
  • Scanning electron microscopy
  • Recrystallization (metallurgy)
  • Boundary migration
  • Thermal grooves

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