Original language | English |
---|---|
Journal | Materials Letters |
Volume | 162 |
Pages (from-to) | 250–253 |
ISSN | 0167-577X |
DOIs | |
Publication status | Published - 2016 |
Investigation of the bonding strength and bonding mechanisms of SOFCs interconnector-electrode interfaces
Dino N. Boccaccini, O. Sevecek, Henrik Lund Frandsen, I. Dlouhy, Sebastian Molin, M. Cannio, Johan Hjelm, Peter Vang Hendriksen
Research output: Contribution to journal › Journal article › Research › peer-review
646
Downloads
(Pure)