Abstract
We present the results from a thorough investigation of the bond strength
between the photo-polymer SU-8 and Au. The data were optained by pull-test experiments, below the glass transition temperature of the polymer. The different aspects that were investigated were: (i) different adhesion promotors
between the SU-8 and Au (ii) the effect of the processing sequence, either
keeping SU-8 as bottum layer or Au (iii) varying the UV exposure dosage of the
SU-8. For comparison, also the bond strength between SU-8 and other materials was measured. We report on bond strength of 4.8 +/- 1.2 MPa between a 7.5 micr.-
layer of SU-8 and Au without any adhesion promoter. This value increases to 11.7
+/- 2.1 MPa for a 30 micr.- layer of SU-8. The value of the bond strength can be
increased by up to 75% using an adhesion promoter and fully optimising the
processing conditions of the SU-8.
| Original language | English |
|---|---|
| Title of host publication | International conference on Micro and Nano Engineering : Conference Proceedings |
| Editors | M. Nordström, B. Clausen, et al. |
| Publisher | Udefineret |
| Publication date | 2004 |
| Pages | 214-215 |
| Publication status | Published - 2004 |
| Event | 30th International Conference on Micro- and Nano-Engineering 2004 - Rotterdam, Netherlands Duration: 19 Sept 2004 → 22 Sept 2004 Conference number: 30 |
Conference
| Conference | 30th International Conference on Micro- and Nano-Engineering 2004 |
|---|---|
| Number | 30 |
| Country/Territory | Netherlands |
| City | Rotterdam |
| Period | 19/09/2004 → 22/09/2004 |