Investigation of the bond strength between the photo-sensitive polymer SU-8 and Au

Maria Nordstrom, Alicia Johansson, E. Sanches-Noguerón, B. Clausen, Montserrat Gomez, Anja Boisen

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Abstract

    We present the results from a thorough investigation of the bond strength between the photo-polymer SU-8 and Au. The data were optained by pull-test experiments, below the glass transition temperature of the polymer. The different aspects that were investigated were: (i) different adhesion promotors between the SU-8 and Au (ii) the effect of the processing sequence, either keeping SU-8 as bottum layer or Au (iii) varying the UV exposure dosage of the SU-8. For comparison, also the bond strength between SU-8 and other materials was measured. We report on bond strength of 4.8 +/- 1.2 MPa between a 7.5 micr.- layer of SU-8 and Au without any adhesion promoter. This value increases to 11.7 +/- 2.1 MPa for a 30 micr.- layer of SU-8. The value of the bond strength can be increased by up to 75% using an adhesion promoter and fully optimising the processing conditions of the SU-8.
    Original languageEnglish
    Title of host publicationInternational conference on Micro and Nano Engineering : Conference Proceedings
    EditorsM. Nordström, B. Clausen, et al.
    PublisherUdefineret
    Publication date2004
    Pages214-215
    Publication statusPublished - 2004
    Event30th International Conference on Micro- and Nano-Engineering 2004 - Rotterdam, Netherlands
    Duration: 19 Sep 200422 Sep 2004
    Conference number: 30

    Conference

    Conference30th International Conference on Micro- and Nano-Engineering 2004
    Number30
    CountryNetherlands
    CityRotterdam
    Period19/09/200422/09/2004

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