Investigation of the bond strength between the photo-sensitive polymer SU-8 and gold

Maria Nordström; Alicia Johansson; E. Sánchez Noguerón; Bjarne Hans Clausen; Montserrat Gomez; Anja Boisen

Investigation of the bond strength between the photo-sensitive polymer SU-8 and gold

Maria Nordström, Alicia Johansson, E. Sánchez Noguerón, Bjarne Hans Clausen, Montserrat Gomez, Anja Boisen

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Abstract

We present the results from a thorough investigation of the bond strength between the photo-polymer SU-8 and Au. The data were obtained by pull-test experiments, below the glass transition temperature of the polymer. The different aspects that we investigated were:(i)the effect of using different adhesion promotors between the SU-8 and Au; (ii) the influence of the processing sequence, keeping either Au or SU-8 as the bottom layer; (iii) the importance of the UV exposure dosage of the SU-8. For comparison, also the bond strength between SU-8 and other materials was measured. For SU-8 and Au without any adhesion promoter we find a bond strength of 4.8+/-1.2 MPa for a 7.5 micr.-layer of SU-8. The value of the bond strength can be increased additionally by up to 75% using an adhesion promoter and fully optimising the processing con- ditions of the SU-8.

Original language	English
Journal	Microelectronic Engineering
Volume	78-79
Pages (from-to)	152-157
ISSN	0167-9317
Publication status	Published - 2005

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@article{54f0648e6dac4feb916ef9c828acd107,

title = "Investigation of the bond strength between the photo-sensitive polymer SU-8 and gold",

abstract = "We present the results from a thorough investigation of the bond strength between the photo-polymer SU-8 and Au. The data were obtained by pull-test experiments, below the glass transition temperature of the polymer. The different aspects that we investigated were:(i)the effect of using different adhesion promotors between the SU-8 and Au; (ii) the influence of the processing sequence, keeping either Au or SU-8 as the bottom layer; (iii) the importance of the UV exposure dosage of the SU-8. For comparison, also the bond strength between SU-8 and other materials was measured. For SU-8 and Au without any adhesion promoter we find a bond strength of 4.8+/-1.2 MPa for a 7.5 micr.-layer of SU-8. The value of the bond strength can be increased additionally by up to 75% using an adhesion promoter and fully optimising the processing con- ditions of the SU-8.",

author = "Maria Nordstr{\"o}m and Alicia Johansson and {S{\'a}nchez Noguer{\'o}n}, E. and Clausen, {Bjarne Hans} and Montserrat Gomez and Anja Boisen",

year = "2005",

language = "English",

volume = "78-79",

pages = "152--157",

journal = "Microelectronic Engineering",

issn = "0167-9317",

publisher = "Elsevier",

}

TY - JOUR

T1 - Investigation of the bond strength between the photo-sensitive polymer SU-8 and gold

AU - Nordström, Maria

AU - Johansson, Alicia

AU - Sánchez Noguerón, E.

AU - Clausen, Bjarne Hans

AU - Gomez, Montserrat

AU - Boisen, Anja

PY - 2005

Y1 - 2005

N2 - We present the results from a thorough investigation of the bond strength between the photo-polymer SU-8 and Au. The data were obtained by pull-test experiments, below the glass transition temperature of the polymer. The different aspects that we investigated were:(i)the effect of using different adhesion promotors between the SU-8 and Au; (ii) the influence of the processing sequence, keeping either Au or SU-8 as the bottom layer; (iii) the importance of the UV exposure dosage of the SU-8. For comparison, also the bond strength between SU-8 and other materials was measured. For SU-8 and Au without any adhesion promoter we find a bond strength of 4.8+/-1.2 MPa for a 7.5 micr.-layer of SU-8. The value of the bond strength can be increased additionally by up to 75% using an adhesion promoter and fully optimising the processing con- ditions of the SU-8.

AB - We present the results from a thorough investigation of the bond strength between the photo-polymer SU-8 and Au. The data were obtained by pull-test experiments, below the glass transition temperature of the polymer. The different aspects that we investigated were:(i)the effect of using different adhesion promotors between the SU-8 and Au; (ii) the influence of the processing sequence, keeping either Au or SU-8 as the bottom layer; (iii) the importance of the UV exposure dosage of the SU-8. For comparison, also the bond strength between SU-8 and other materials was measured. For SU-8 and Au without any adhesion promoter we find a bond strength of 4.8+/-1.2 MPa for a 7.5 micr.-layer of SU-8. The value of the bond strength can be increased additionally by up to 75% using an adhesion promoter and fully optimising the processing con- ditions of the SU-8.

M3 - Journal article

SN - 0167-9317

VL - 78-79

SP - 152

EP - 157

JO - Microelectronic Engineering

JF - Microelectronic Engineering

ER -