Investigation of Pt Diffusion into SnPb(60/40) Solder by SIMS
                Profiling from the Backside

Research output: Chapter in Book/Report/Conference proceeding › Book chapter › Research › peer-review

Original language	English
Title of host publication	MicroMat '97
Publication date	1997
Pages	874-877
Publication status	Published - 1997
Event	2nd International Conference and Exhibition Micro Materials - Berlin, Germany Duration: 16 Apr 1997 → 18 Apr 1997 Conference number: 2

Conference	2nd International Conference and Exhibition Micro Materials
Number	2
Country/Territory	Germany
City	Berlin
Period	16/04/1997 → 18/04/1997

OpenUrl availability

@inbook{419a324b3bb44513a7d3f19011ca8ef4,

title = "Investigation of Pt Diffusion into SnPb(60/40) Solder by SIMS Profiling from the Backside",

author = "C.-H. Chiang and Kuhmann, \{Jochen Friedrich\} and P. Harde and F. Reier and W. {\"O}sterle",

year = "1997",

language = "English",

pages = "874--877",

booktitle = "MicroMat '97",

note = "2nd International Conference and Exhibition Micro Materials, MicroMat '97 ; Conference date: 16-04-1997 Through 18-04-1997",

}

TY - CHAP

T1 - Investigation of Pt Diffusion into SnPb(60/40) Solder by SIMS Profiling from the Backside

AU - Chiang, C.-H.

AU - Kuhmann, Jochen Friedrich

AU - Harde, P.

AU - Reier, F.

AU - Österle, W.

N1 - Conference code: 2

PY - 1997

Y1 - 1997

M3 - Book chapter

SP - 874

EP - 877

BT - MicroMat '97

T2 - 2nd International Conference and Exhibition Micro Materials

Y2 - 16 April 1997 through 18 April 1997

ER -