Abstract
As part of the ongoing effort to optimize the throughput of the Athena optics we have produced mirrors with a state-of-the-art cleaning process. We report on the studies related to the importance of the photolithographic process. Pre-coating characterization of the mirrors has shown and still shows photoresist remnants on the SiO2- rib bonding zones, which influences the quality of the metallic coating and ultimately the mirror performance. The size of the photoresist remnants is on the order of 10 nm which is about half the thickness of final metallic coating. An improved photoresist process has been developed including cleaning with O2 plasma in order to remove the remaining photoresist remnants prior to coating. Surface roughness results indicate that the SiO2-rib bonding zones are as clean as before the photolithography process is performed.
Original language | English |
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Title of host publication | Proceedings of SPIE |
Volume | 9603 |
Publisher | SPIE - International Society for Optical Engineering |
Publication date | 2015 |
Article number | 96030M |
DOIs | |
Publication status | Published - 2015 |
Event | Optics for EUV, X-Ray, and Gamma-Ray Astronomy VII: Conference 9603 - San Diego Convention Center, San Diego, United States Duration: 10 Aug 2015 → 13 Aug 2015 Conference number: 7 |
Conference
Conference | Optics for EUV, X-Ray, and Gamma-Ray Astronomy VII |
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Number | 7 |
Location | San Diego Convention Center |
Country/Territory | United States |
City | San Diego |
Period | 10/08/2015 → 13/08/2015 |
Series | Proceedings of SPIE - The International Society for Optical Engineering |
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ISSN | 0277-786X |
Bibliographical note
Copyright 2015 Society of Photo Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic electronic or print reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.Keywords
- Athena
- Silicon Pore Optics (SPO)
- AFM
- SEM
- Photoresist
- Surface Roughness
- Photolithography Process
- O2 Plasma
- Stacking