Miniaturized devices with increased functionality can be obtained by means of incorporation of metal micro parts in a polymer matrix. They allow achieving both conductive circuits and mechanical functions in the same device, enabling design of MIDs with enhanced characteristics. New design principles, in-process manufacturing technologies, as well as testing methodologies have to be established in order to be able to develop such integrated devices. In this paper an investigation of the bonding between miniaturized metal insert and a polymer matrix is presented. A special demonstrator was designed and manufactured by over-moulding and hot-embossing. The bonding strength between the insert and the plastic part was tested by means of a tensile test. A variety of parameters was studied in order to investigate their influence on the bonding: different polymeric and metallic materials, insert thickness, metal surface roughness and texture topography, surface treatment and coating, i.e. metal insert designs to improve polymer/metal interlocking and tensile test speed. Results show a strong influence of the surface properties and of the employed material on the bonding strength. The proposed testing procedure provides properties, characteristics, and data to be used when dimensioning and designing MIDs which involves conductive and mechanical functions.
|Title of host publication||Proceedings of 7th International Congress MID 2006|
|Number of pages||292|
|Place of Publication||Erlangen, Germany|
|Publisher||Meisenbach GmbH, Bamberg|
|Publication status||Published - 2006|
|Event||7th International Congress Molded Interconnect Devices : MID 2006 - Fuerth, Germany|
Duration: 1 Jan 2006 → …
|Conference||7th International Congress Molded Interconnect Devices : MID 2006|
|Period||01/01/2006 → …|
Tosello, G., Hansen, H. N., & Tang, P. T. (2006). Investigation of over-moulded hybrid metal/polymer devices. In Proceedings of 7th International Congress MID 2006 (pp. 279-292). Meisenbach GmbH, Bamberg.