Investigation of moisture uptake into printed circuit board laminate and solder mask materials

Helene Conseil; Visweswara Chakravarthy Gudla; Shruti Borgaonkar; Morten Stendahl Jellesen; Rajan Ambat

doi:10.1007/s10854-016-6292-5

Investigation of moisture uptake into printed circuit board laminate and solder mask materials

Helene Conseil, Visweswara Chakravarthy Gudla, Shruti Borgaonkar, Morten Stendahl Jellesen, Rajan Ambat

Research output: Contribution to journal › Journal article › Research › peer-review

Abstract

Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic such as diffusivity, permeability, and solubility. In addition, the effect of a reflow soldering simulation on microstructural changes and onincrease of water uptake of the materials has been analysed

Original language	English
Journal	Journal of Materials Science: Materials in Electronics
Volume	28
Issue number	8
Pages (from-to)	6138-6151
Number of pages	14
ISSN	0957-4522
DOIs	https://doi.org/10.1007/s10854-016-6292-5
Publication status	Published - 2017

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title = "Investigation of moisture uptake into printed circuit board laminate and solder mask materials",

abstract = "Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic such as diffusivity, permeability, and solubility. In addition, the effect of a reflow soldering simulation on microstructural changes and onincrease of water uptake of the materials has been analysed",

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AU - Conseil, Helene

AU - Gudla, Visweswara Chakravarthy

AU - Borgaonkar, Shruti

AU - Jellesen, Morten Stendahl

AU - Ambat, Rajan

PY - 2017

Y1 - 2017

N2 - Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic such as diffusivity, permeability, and solubility. In addition, the effect of a reflow soldering simulation on microstructural changes and onincrease of water uptake of the materials has been analysed

AB - Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic such as diffusivity, permeability, and solubility. In addition, the effect of a reflow soldering simulation on microstructural changes and onincrease of water uptake of the materials has been analysed

U2 - 10.1007/s10854-016-6292-5

DO - 10.1007/s10854-016-6292-5

M3 - Journal article

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JO - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

IS - 8

ER -

Investigation of moisture uptake into printed circuit board laminate and solder mask materials

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