Investigation of moisture uptake into printed circuit board laminate and solder mask materials

Helene Conseil, Visweswara Chakravarthy Gudla, Shruti Borgaonkar, Morten Stendahl Jellesen, Rajan Ambat

Research output: Contribution to journalJournal articleResearchpeer-review

Abstract

Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic such as diffusivity, permeability, and solubility. In addition, the effect of a reflow soldering simulation on microstructural changes and onincrease of water uptake of the materials has been analysed
Original languageEnglish
JournalJournal of Materials Science: Materials in Electronics
Volume28
Issue number8
Pages (from-to)6138-6151
Number of pages14
ISSN0957-4522
DOIs
Publication statusPublished - 2017

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