Investigation of Heat Sink Efficiency for Electronic Component Cooling Applications

Ž. Staliulionis, Zhe Zhang, Riccardo Pittini, Michael A. E. Andersen, P. Tarvydas, A. Noreika

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Abstract

Research and optimisation of cooling of electronic components using heat sinks becomes increasingly important in modern industry. Numerical methods with experimental real-world verification are the main tools to evaluate efficiency of heat sinks or heat sink systems. Here the investigation of relatively simple heat sink application is performed using modeling based on finite element method, and also the
potential of such analysis was demonstrated by real-world measurements and comparing obtained results. Thermal modeling was accomplished using finite element analysis software COMSOL and thermo-imaging camera was used to measure the thermal field distribution. Ideas for future research involving improvement of the experimental setup and modeling verification are given.
Original languageEnglish
JournalElektronika ir Elektrotechnika
Volume20
Issue number1
Pages (from-to)49-54
Number of pages7
ISSN1392-1215
DOIs
Publication statusPublished - 2014

Keywords

  • Finite Element Method
  • Heat sinks
  • Temperature measurement

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