Investigation of Electronic Corrosion at Device Level

Morten Stendahl Jellesen; Daniel Minzari; Umadevi Rathinavelu; Per Møller; Rajan Ambat

doi:10.1149/1.3321952

Investigation of Electronic Corrosion at Device Level

Morten Stendahl Jellesen
, Daniel Minzari
, Umadevi Rathinavelu
, Per Møller
, Rajan Ambat

Research output: Contribution to journal › Conference article › Research › peer-review

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Abstract

This work presents device level testing of a lead free soldered electronic device tested with bias on under cyclic humidity conditions in a climatic chamber. Besides severe temperature and humidity during testing some devices were deliberately contaminated before testing. Contaminants investigated are ionic or airborne contaminants likely to be introduced by production or service conditions. The effect of changes in processing parameters as a result of production shift to lead free solder (e.g. higher soldering temperature) has also been investigated. Analysis have shown that one printed circuit board assembly (PCBA) in the device is more prone to corrosion reliability and this was further analysed using thermography to detect areas that have high risk of condensation due to lower temperature under working condition. Tested PCBAs are subjected to detailed investigation before and after testing using high resolution photography, detailed optical microscopy and SEM/EDS.

Original language	English
Journal	ECS Transactions
Volume	25
Issue number	30
Pages (from-to)	1-14
ISSN	1938-5862
DOIs	https://doi.org/10.1149/1.3321952
Publication status	Published - 2010
Event	216th ECS Meeting: EuroCVD 17 and SOFC XI - 11^th International Symposium on Solid Oxide Fuel Cells - Vienna, Austria Duration: 4 Oct 2009 → 9 Oct 2009 Conference number: 216

Conference

Conference	216th ECS Meeting
Number	216
Country/Territory	Austria
City	Vienna
Period	04/10/2009 → 09/10/2009

Bibliographical note

Copyright The Electrochemical Society, Inc. [2010]. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS).

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title = "Investigation of Electronic Corrosion at Device Level",

abstract = "This work presents device level testing of a lead free soldered electronic device tested with bias on under cyclic humidity conditions in a climatic chamber. Besides severe temperature and humidity during testing some devices were deliberately contaminated before testing. Contaminants investigated are ionic or airborne contaminants likely to be introduced by production or service conditions. The effect of changes in processing parameters as a result of production shift to lead free solder (e.g. higher soldering temperature) has also been investigated. Analysis have shown that one printed circuit board assembly (PCBA) in the device is more prone to corrosion reliability and this was further analysed using thermography to detect areas that have high risk of condensation due to lower temperature under working condition. Tested PCBAs are subjected to detailed investigation before and after testing using high resolution photography, detailed optical microscopy and SEM/EDS.",

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note = "Copyright The Electrochemical Society, Inc. [2010]. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS).; 216th ECS Meeting : EuroCVD 17 and SOFC XI - 11<sup>th</sup> International Symposium on Solid Oxide Fuel Cells, SOFC-XI ; Conference date: 04-10-2009 Through 09-10-2009",

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AU - Møller, Per

AU - Ambat, Rajan

N1 - Conference code: 216

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N2 - This work presents device level testing of a lead free soldered electronic device tested with bias on under cyclic humidity conditions in a climatic chamber. Besides severe temperature and humidity during testing some devices were deliberately contaminated before testing. Contaminants investigated are ionic or airborne contaminants likely to be introduced by production or service conditions. The effect of changes in processing parameters as a result of production shift to lead free solder (e.g. higher soldering temperature) has also been investigated. Analysis have shown that one printed circuit board assembly (PCBA) in the device is more prone to corrosion reliability and this was further analysed using thermography to detect areas that have high risk of condensation due to lower temperature under working condition. Tested PCBAs are subjected to detailed investigation before and after testing using high resolution photography, detailed optical microscopy and SEM/EDS.

AB - This work presents device level testing of a lead free soldered electronic device tested with bias on under cyclic humidity conditions in a climatic chamber. Besides severe temperature and humidity during testing some devices were deliberately contaminated before testing. Contaminants investigated are ionic or airborne contaminants likely to be introduced by production or service conditions. The effect of changes in processing parameters as a result of production shift to lead free solder (e.g. higher soldering temperature) has also been investigated. Analysis have shown that one printed circuit board assembly (PCBA) in the device is more prone to corrosion reliability and this was further analysed using thermography to detect areas that have high risk of condensation due to lower temperature under working condition. Tested PCBAs are subjected to detailed investigation before and after testing using high resolution photography, detailed optical microscopy and SEM/EDS.

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Investigation of Electronic Corrosion at Device Level

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