Investigation of Electronic Corrosion at Device Level

Morten Stendahl Jellesen; Daniel Minzari; Umadevi Rathinavelu; Per Møller; Rajan Ambat

doi:10.1149/1.3321952

Investigation of Electronic Corrosion at Device Level

Morten Stendahl Jellesen, Daniel Minzari, Umadevi Rathinavelu, Per Møller, Rajan Ambat

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Abstract

This work presents device level testing of a lead free soldered electronic device tested with bias on under cyclic humidity conditions in a climatic chamber. Besides severe temperature and humidity during testing some devices were deliberately contaminated before testing. Contaminants investigated are ionic or airborne contaminants likely to be introduced by production or service conditions. The effect of changes in processing parameters as a result of production shift to lead free solder (e.g. higher soldering temperature) has also been investigated. Analysis have shown that one printed circuit board assembly (PCBA) in the device is more prone to corrosion reliability and this was further analysed using thermography to detect areas that have high risk of condensation due to lower temperature under working condition. Tested PCBAs are subjected to detailed investigation before and after testing using high resolution photography, detailed optical microscopy and SEM/EDS.

Original language	English
Journal	E C S Transactions
Volume	25
Issue number	30
Pages (from-to)	1-14
ISSN	1938-5862
DOIs	https://doi.org/10.1149/1.3321952
Publication status	Published - 2010
Event	ECS Meeting : Corrosion of Electronic and Magnetic Materials - Vienna, Austria Duration: 1 Jan 2009 → … Conference number: 216th

Conference

Conference	ECS Meeting : Corrosion of Electronic and Magnetic Materials
Number	216th
City	Vienna, Austria
Period	01/01/2009 → …

Bibliographical note

Copyright The Electrochemical Society, Inc. [2010]. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS).

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title = "Investigation of Electronic Corrosion at Device Level",

abstract = "This work presents device level testing of a lead free soldered electronic device tested with bias on under cyclic humidity conditions in a climatic chamber. Besides severe temperature and humidity during testing some devices were deliberately contaminated before testing. Contaminants investigated are ionic or airborne contaminants likely to be introduced by production or service conditions. The effect of changes in processing parameters as a result of production shift to lead free solder (e.g. higher soldering temperature) has also been investigated. Analysis have shown that one printed circuit board assembly (PCBA) in the device is more prone to corrosion reliability and this was further analysed using thermography to detect areas that have high risk of condensation due to lower temperature under working condition. Tested PCBAs are subjected to detailed investigation before and after testing using high resolution photography, detailed optical microscopy and SEM/EDS.",

author = "Jellesen, {Morten Stendahl} and Daniel Minzari and Umadevi Rathinavelu and Per M{\o}ller and Rajan Ambat",

note = "Copyright The Electrochemical Society, Inc. [2010]. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS).; ECS Meeting : Corrosion of Electronic and Magnetic Materials ; Conference date: 01-01-2009",

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AU - Møller, Per

AU - Ambat, Rajan

N1 - Conference code: 216th

PY - 2010

Y1 - 2010

N2 - This work presents device level testing of a lead free soldered electronic device tested with bias on under cyclic humidity conditions in a climatic chamber. Besides severe temperature and humidity during testing some devices were deliberately contaminated before testing. Contaminants investigated are ionic or airborne contaminants likely to be introduced by production or service conditions. The effect of changes in processing parameters as a result of production shift to lead free solder (e.g. higher soldering temperature) has also been investigated. Analysis have shown that one printed circuit board assembly (PCBA) in the device is more prone to corrosion reliability and this was further analysed using thermography to detect areas that have high risk of condensation due to lower temperature under working condition. Tested PCBAs are subjected to detailed investigation before and after testing using high resolution photography, detailed optical microscopy and SEM/EDS.

AB - This work presents device level testing of a lead free soldered electronic device tested with bias on under cyclic humidity conditions in a climatic chamber. Besides severe temperature and humidity during testing some devices were deliberately contaminated before testing. Contaminants investigated are ionic or airborne contaminants likely to be introduced by production or service conditions. The effect of changes in processing parameters as a result of production shift to lead free solder (e.g. higher soldering temperature) has also been investigated. Analysis have shown that one printed circuit board assembly (PCBA) in the device is more prone to corrosion reliability and this was further analysed using thermography to detect areas that have high risk of condensation due to lower temperature under working condition. Tested PCBAs are subjected to detailed investigation before and after testing using high resolution photography, detailed optical microscopy and SEM/EDS.

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ER -

Investigation of Electronic Corrosion at Device Level

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