Interface crack growth by void expansion mechanisms between ductile solid and elastic substrate

Viggo Tvergaard (Invited author)

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Original language	English
Title of host publication	Proc. of ICF11
Volume	On CD
Publication date	2005
Publication status	Published - 2005
Event	11th International Conference on Fracture - Turin, Italy Duration: 20 Mar 2005 → 25 Mar 2005 Conference number: 11

Conference	11th International Conference on Fracture
Number	11
Country/Territory	Italy
City	Turin
Period	20/03/2005 → 25/03/2005

OpenUrl availability

@inproceedings{b04b7f2969854a348eb472aa642db364,

title = "Interface crack growth by void expansion mechanisms between ductile solid and elastic substrate",

author = "Viggo Tvergaard",

year = "2005",

language = "English",

volume = "On CD",

booktitle = "Proc. of ICF11",

note = "11th International Conference on Fracture ; Conference date: 20-03-2005 Through 25-03-2005",

}