Interconnect Layer with Advanced Multiple Feedthrough for an Integrated Microphone for Hearing Aid Applications

M. Heschel, Kurt Rasmussen, Peter Torben Tang, Jochen Kuhmann, S. Bouwstra

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Abstract

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    Original languageEnglish
    Title of host publicationTransducers '99
    Publication date1998
    Publication statusPublished - 1998
    Event10th International Conference on Solid-State Sensors and Actuators (Transducers ’99) - Sendai, Japan
    Duration: 1 Jan 1999 → …
    Conference number: 10

    Conference

    Conference10th International Conference on Solid-State Sensors and Actuators (Transducers ’99)
    Number10
    CountryJapan
    CitySendai
    Period01/01/1999 → …

    Cite this

    Heschel, M., Rasmussen, K., Tang, P. T., Kuhmann, J., & Bouwstra, S. (1998). Interconnect Layer with Advanced Multiple Feedthrough for an Integrated Microphone for Hearing Aid Applications. In Transducers '99