Integrated packaging concept for an intelligent transducer

Matthias Heschel, Jochen Friedrich Kuhmann, Siebe Bouwstra, M. Amskov

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Original language	English
Title of host publication	Integrated packaging concept for an intelligent transducer
Publisher	SPIE
Publication date	1999
Pages	344-52
Publication status	Published - 1999
Event	5th Annual International Symposium on Smart Structures and Materials - San Diego, United States Duration: 1 Mar 1998 → 5 Mar 1998

Conference	5th Annual International Symposium on Smart Structures and Materials
Country/Territory	United States
City	San Diego
Period	01/03/1998 → 05/03/1998

OpenUrl availability

@inproceedings{53204cbfb10046b69e958e09104dd6e4,

title = "Integrated packaging concept for an intelligent transducer",

author = "Matthias Heschel and Kuhmann, {Jochen Friedrich} and Siebe Bouwstra and M. Amskov",

year = "1999",

language = "English",

pages = "344--52",

booktitle = "Integrated packaging concept for an intelligent transducer",

publisher = "SPIE",

address = "United States",

note = "5th Annual International Symposium on Smart Structures and Materials ; Conference date: 01-03-1998 Through 05-03-1998",

}

TY - GEN

T1 - Integrated packaging concept for an intelligent transducer

AU - Heschel, Matthias

AU - Kuhmann, Jochen Friedrich

AU - Bouwstra, Siebe

AU - Amskov, M.

PY - 1999

Y1 - 1999

M3 - Article in proceedings

SP - 344

EP - 352

BT - Integrated packaging concept for an intelligent transducer

PB - SPIE

T2 - 5th Annual International Symposium on Smart Structures and Materials

Y2 - 1 March 1998 through 5 March 1998

ER -