Integrated packaging concept for an intelligent transducer

Matthias Heschel, Jochen Friedrich Kuhmann, Siebe Bouwstra, M. Amskov

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Original languageEnglish
    Title of host publicationIntegrated packaging concept for an intelligent transducer
    PublisherSPIE
    Publication date1999
    Pages344-52
    Publication statusPublished - 1999
    EventSymposium on Smart Electronics and MEMS. Proceedings of the SPIE - The International Society for Optical - San Diego,Calif.
    Duration: 1 Jan 1998 → …

    Conference

    ConferenceSymposium on Smart Electronics and MEMS. Proceedings of the SPIE - The International Society for Optical
    CitySan Diego,Calif.
    Period01/01/1998 → …

    Cite this