Integrated in situ self-aligned double patterning process with fluorocarbon as spacer layer

Material Science

• Film 100%
• Dielectric Material 50%
• Device Fabrication 50%
• Nanocrystalline Material 50%
• Plasma Etching 50%
• Lithography 50%
• Chemical Vapor Deposition 50%
• Silicon 50%
• Microelectromechanical System 50%
• Optical Device 50%

Keyphrases

• Self-aligned Double Patterning 100%
• Photonic Device Fabrication 25%
• Double Patterning Lithography 25%
• Critical Dimension Control 25%
• Spacer Lithography 25%