Abstract
This paper presents a novel InP-SiGe BiCMOS technology using wafer-scale heterogeneous integration. The vertical stacking of the InP double heterojunction bipolar transistor (DHBT) circuitry directly on top of the BiCMOS wafer enables ultra-broadband interconnects with <0.2 dB insertion loss from 0-100 GHz. The 0.8 × 5 μm2 InP DHBTs show fT/fmax of 400/350 GHz with an output power of more than 26 mW at 96 GHz. These are record values for a heterogeneously integrated transistor on silicon. As a circuit example, a 164-GHz signal source is presented. It features a voltage-controlled oscillator in BiCMOS, which drives a doubler-amplifier chain in InP DHBT technology.
| Original language | English |
|---|---|
| Journal | I E E E Transactions on Electron Devices |
| Volume | 60 |
| Issue number | 7 |
| Pages (from-to) | 2209-2216 |
| ISSN | 0018-9383 |
| DOIs | |
| Publication status | Published - 2013 |
Keywords
- BiCMOS integrated circuits
- Double heterojunction bipolar transistors (DHBT)
- Integrated circuit design
- Millimeter wave circuits
- Voltage-controlled oscillators (VCOs)
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