Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys

Feng Li*, Vadimas Verdingovas, Kai Dirscherl, Gábor Harsányi, Bálint Medgyes, Rajan Ambat

*Corresponding author for this work

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Physics & Astronomy

Chemical Compounds

Engineering & Materials Science