TY - JOUR
T1 - Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys
AU - Li, Feng
AU - Verdingovas, Vadimas
AU - Dirscherl, Kai
AU - Harsányi, Gábor
AU - Medgyes, Bálint
AU - Ambat, Rajan
PY - 2020
Y1 - 2020
N2 - Sn–Ag–Cu solder alloys were usually modified using trace elements to achieve various properties. This paper investigated the effect of additives of Ni, Bi, and Sb on the microstructure and corrosion behavior of SAC alloys under application condition. Investigation was carried out using both solder alloy ingots and reflow-soldered surface insulation resistance interdigitated patterns by electrochemical methods under humid and corrosive conditions. Microstructure analysis was performed using X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy etc. Volta potential distribution in the bulk of the alloy was analyzed by Scanning Kelvin Probe Force Microscopy. Results show the passivation domain of five tested solder alloys did not influence the susceptibility of electrochemical migration under 5 V DC bias loading. Ni and Bi additives resulted in lower susceptibility of electrochemical migration due to homogeneity of the IMCs distribution in the bulk alloys. Bi precipitates in InnoLot alloy participated micro-galvanic corrosion as cathode rather than Ag containing phase as known before.
AB - Sn–Ag–Cu solder alloys were usually modified using trace elements to achieve various properties. This paper investigated the effect of additives of Ni, Bi, and Sb on the microstructure and corrosion behavior of SAC alloys under application condition. Investigation was carried out using both solder alloy ingots and reflow-soldered surface insulation resistance interdigitated patterns by electrochemical methods under humid and corrosive conditions. Microstructure analysis was performed using X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy etc. Volta potential distribution in the bulk of the alloy was analyzed by Scanning Kelvin Probe Force Microscopy. Results show the passivation domain of five tested solder alloys did not influence the susceptibility of electrochemical migration under 5 V DC bias loading. Ni and Bi additives resulted in lower susceptibility of electrochemical migration due to homogeneity of the IMCs distribution in the bulk alloys. Bi precipitates in InnoLot alloy participated micro-galvanic corrosion as cathode rather than Ag containing phase as known before.
U2 - 10.1007/s10854-020-04095-y
DO - 10.1007/s10854-020-04095-y
M3 - Journal article
AN - SCOPUS:85088862323
SN - 0957-4522
VL - 31
SP - 15308
EP - 15321
JO - Journal of Materials Science: Materials in Electronics
JF - Journal of Materials Science: Materials in Electronics
ER -