Influence of grain boundary structure on bubble formation behaviour in helium implanted copper

P.A. Thorsen, Jørgen Bilde-Sørensen, B.N. Singh

    Research output: Contribution to journalJournal articleResearchpeer-review

    Original languageEnglish
    JournalMaterials Science Forum
    Volume207/209
    Pages (from-to)445-448
    ISSN0255-5476
    Publication statusPublished - 1996

    Cite this