Influence of grain boundary structure on bubble formation behaviour in helium implanted copper

P.A. Thorsen, Jørgen Bilde-Sørensen, B.N. Singh

    Research output: Contribution to journalJournal articleResearchpeer-review

    Abstract

    Grain boundaries in copper implanted with helium at elevated temperature have been examined by transmission electron microscopy. Helium bubbles are formed at the boundaries while denuded zones are formed along some of the boundaries. The character of a number of boundaries were determined and related to the size of the bubbles in the boundary and to the width of the denuded zones. The results are discussed in terms of the efficiency of the boundaries as sinks and diffusion paths for helium.
    Original languageEnglish
    JournalMaterials Science Forum
    Volume207-209
    Issue numberPART 2
    Pages (from-to)445-448
    ISSN0255-5476
    DOIs
    Publication statusPublished - 1996

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