Increasing Penetration Depth and Field-of-view in 3D Ultrasound Imaging with a Lensed Row-column Array

Ali Salari*, Mélanie Audoin, Borislav Gueorguiev Tomov, Erik Vilain Thomsen, Jørgen Arendt Jensen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

Row-column (RC) arrays are a promising alternative to conventional matrix arrays for large volumetric imaging due to their fewer electrical connections. However, RC arrays have a restricted field of view. A diverging lens can be used to increase the FOV, but it also causes a decrease in the signal-to-noise ratio (SNR). Previous studies were restricted by using one-element emissions, which have a low SNR. It is hypothesized that using multi-element emission with convex lenses can compensate for the attenuation created by a lens and increase the penetration depth while preserving the FOV. A Vermon RC array with 128+128 elements at 6 MHz and λ pitch was used on the Verasonics Vantage 256 scanner. A single-element emission sequence was used, while 128 orthogonal elements for reception were employed. Also, a multi-element emission method with 2×96 emissions on the rows and columns and acquiring with all orthogonal elements was used. To extend the FOV, two lenses made of polymethylpentene (TPX) and polystyrene (PS) in a convex spherical shape were investigated. The lenses were assessed and compared in terms of Field of View (FOV) and Signal to Noise Ratio (SNR). PS lens had a FOV of about 11.2 degrees, while TPX had a FOV of 9.7 degrees. PS lens had a 5 dB higher SNR in various depths than TPX lenses due to their materials and attenuation coefficients. While maintaining the increased FOV achieved with lenses, multi-element emission sequences increased the penetration depth by around 30 mm and SNR by 25 dB.

Original languageEnglish
Title of host publicationProceedings of the 2023 IEEE International Ultrasonics Symposium
Number of pages4
PublisherIEEE
Publication date2023
ISBN (Electronic)79-8-3503-4645-9
DOIs
Publication statusPublished - 2023
Event2023 IEEE International Ultrasonics Symposium - Palais des congrès de Montréal, Montreal, Canada
Duration: 3 Sept 20238 Sept 2023
Conference number: 61

Conference

Conference2023 IEEE International Ultrasonics Symposium
Number61
LocationPalais des congrès de Montréal
Country/TerritoryCanada
CityMontreal
Period03/09/202308/09/2023
SeriesProceedings of the IEEE Ultrasonics Symposium
Volume2023
ISSN1051-0117

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