In situ observation of triple junction motion during recovery of heavily deformed aluminum

Tianbo Yu, Darcy A. Hughes, Niels Hansen, Xiaoxu Huang

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    Microstructural evolution during in situ annealing of heavily cold-rolled aluminum has been studied by transmission electron microscopy, confirming that an important recovery mechanism is migration of triple junctions formed by three lamellar boundaries (Y-junctions). The migrating Y-junctions are pinned by deformation-induced interconnecting and lamellar boundaries, which slow down the recovery process and lead to a stop-go migration pattern. This pinning mechanism stabilizes the deformation microstructure, i.e. the structure is stabilized by balancing the driving and pinning forces controlling the rate of triple junction motion. As a consequence, recovery and the subsequent recrystallization are strongly retarded. The mechanisms underlying Y-junction motion and its pinning are analyzed and discussed.
    Original languageEnglish
    JournalActa Materialia
    Pages (from-to)269-278
    Number of pages10
    Publication statusPublished - 2015

    Bibliographical note

    The authors gratefully acknowledge the support from the Danish National Research Foundation (Grant No. DNRF86-5) and the National Natural Science Foundation of China (Grant No. 51261130091) to the Danish–Chinese Center for Nanometals, within which this work has been performed.


    • Aluminum
    • Annealing
    • Deformation structure
    • Transmission electron microscopy (TEM)
    • Triple junction
    • Cold rolling
    • Deformation
    • Electron microscopy
    • Metal cladding
    • Transmission electron microscopy
    • Cold-rolled aluminum
    • Deformation microstructure
    • In-situ observations
    • Lamellar boundaries
    • Migration patterns
    • Recovery mechanisms
    • Recovery


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