Abstract
Microstructural evolution during in situ annealing of heavily cold-rolled aluminum has been studied by transmission electron microscopy, confirming that an important recovery mechanism is migration of triple junctions formed by three lamellar boundaries (Y-junctions). The migrating Y-junctions are pinned by deformation-induced interconnecting and lamellar boundaries, which slow down the recovery process and lead to a stop-go migration pattern. This pinning mechanism stabilizes the deformation microstructure, i.e. the structure is stabilized by balancing the driving and pinning forces controlling the rate of triple junction motion. As a consequence, recovery and the subsequent recrystallization are strongly retarded. The mechanisms underlying Y-junction motion and its pinning are analyzed and discussed.
Original language | English |
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Journal | Acta Materialia |
Volume | 86 |
Pages (from-to) | 269-278 |
Number of pages | 10 |
ISSN | 1359-6454 |
DOIs | |
Publication status | Published - 2015 |
Bibliographical note
The authors gratefully acknowledge the support from the Danish National Research Foundation (Grant No. DNRF86-5) and the National Natural Science Foundation of China (Grant No. 51261130091) to the Danish–Chinese Center for Nanometals, within which this work has been performed.Keywords
- Aluminum
- Annealing
- Deformation structure
- Transmission electron microscopy (TEM)
- Triple junction
- Cold rolling
- Deformation
- Electron microscopy
- Metal cladding
- Transmission electron microscopy
- Cold-rolled aluminum
- Deformation microstructure
- In-situ observations
- Lamellar boundaries
- Migration patterns
- Recovery mechanisms
- Recovery