In situ observation of triple junction motion during recovery of heavily deformed aluminum

Tianbo Yu, Darcy A. Hughes, Niels Hansen, Xiaoxu Huang

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Microstructural evolution during in situ annealing of heavily cold-rolled aluminum has been studied by transmission electron microscopy, confirming that an important recovery mechanism is migration of triple junctions formed by three lamellar boundaries (Y-junctions). The migrating Y-junctions are pinned by deformation-induced interconnecting and lamellar boundaries, which slow down the recovery process and lead to a stop-go migration pattern. This pinning mechanism stabilizes the deformation microstructure, i.e. the structure is stabilized by balancing the driving and pinning forces controlling the rate of triple junction motion. As a consequence, recovery and the subsequent recrystallization are strongly retarded. The mechanisms underlying Y-junction motion and its pinning are analyzed and discussed.
Original languageEnglish
JournalActa Materialia
Pages (from-to)269-278
Number of pages10
Publication statusPublished - 2015

Bibliographical note

The authors gratefully acknowledge the support from the Danish National Research Foundation (Grant No. DNRF86-5) and the National Natural Science Foundation of China (Grant No. 51261130091) to the Danish–Chinese Center for Nanometals, within which this work has been performed.


  • Aluminum
  • Annealing
  • Deformation structure
  • Transmission electron microscopy (TEM)
  • Triple junction
  • Cold rolling
  • Deformation
  • Electron microscopy
  • Metal cladding
  • Transmission electron microscopy
  • Cold-rolled aluminum
  • Deformation microstructure
  • In-situ observations
  • Lamellar boundaries
  • Migration patterns
  • Recovery mechanisms
  • Recovery


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