In-situ Investigation of Lead-free Solder Alloy Formation Using a Hot-plate Microscope

René Bergmann, Peter Torben Tang, Hans Nørgaard Hansen, Per Møller

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    Abstract

    This work presents the advantages of using a hot-plate microscope for investigation of new (high-temperature) lead- free solders as in-situ analysis tool and preparation equipment. A description of the equipment and the preparation method is given and some examples are outlined. The formation of small AuSn-based, homogeneous and un-oxidized solder spheres will be demonstrated. Moreover the possibility of using this equipment as a sample preparation method to further investigation is shown. As example the equipment was used to produce samples for Vickers microhardness measurement of important phases of the Au-Sn system. The measured values are comparable to those found in the literature. An outlook to further research is also given.
    Original languageEnglish
    Title of host publicationProceedings of the 9th IEEE Electronics Packaging Technology Conference
    PublisherIEEE
    Publication date2007
    ISBN (Print)978-1-4244-1323-2
    DOIs
    Publication statusPublished - 2007
    Event9th IEEE Electronics Packaging Technology Conference - Singapore
    Duration: 1 Jan 2007 → …

    Conference

    Conference9th IEEE Electronics Packaging Technology Conference
    CitySingapore
    Period01/01/2007 → …

    Bibliographical note

    Copyright: 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

    Cite this

    Bergmann, R., Tang, P. T., Hansen, H. N., & Møller, P. (2007). In-situ Investigation of Lead-free Solder Alloy Formation Using a Hot-plate Microscope. In Proceedings of the 9th IEEE Electronics Packaging Technology Conference IEEE. https://doi.org/10.1109/EPTC.2007.4469822