This work presents the advantages of using a hot-plate microscope for investigation of new (high-temperature) lead- free solders as in-situ analysis tool and preparation equipment. A description of the equipment and the preparation method is given and some examples are outlined. The formation of small AuSn-based, homogeneous and un-oxidized solder spheres will be demonstrated. Moreover the possibility of using this equipment as a sample preparation method to further investigation is shown. As example the equipment was used to produce samples for Vickers microhardness measurement of important phases of the Au-Sn system. The measured values are comparable to those found in the literature. An outlook to further research is also given.
|Title of host publication||Proceedings of the 9th IEEE Electronics Packaging Technology Conference|
|Publication status||Published - 2007|
|Event||9th IEEE Electronics Packaging Technology Conference - Singapore|
Duration: 1 Jan 2007 → …
|Conference||9th IEEE Electronics Packaging Technology Conference|
|Period||01/01/2007 → …|