In-situ Investigation of Lead-free Solder Alloy Formation Using a Hot-plate Microscope

René Bergmann; Peter Torben Tang; Hans Nørgaard Hansen; Per Møller

doi:10.1109/EPTC.2007.4469822

In-situ Investigation of Lead-free Solder Alloy Formation Using a Hot-plate Microscope

René Bergmann, Peter Torben Tang, Hans Nørgaard Hansen, Per Møller

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

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Abstract

This work presents the advantages of using a hot-plate microscope for investigation of new (high-temperature) lead- free solders as in-situ analysis tool and preparation equipment. A description of the equipment and the preparation method is given and some examples are outlined. The formation of small AuSn-based, homogeneous and un-oxidized solder spheres will be demonstrated. Moreover the possibility of using this equipment as a sample preparation method to further investigation is shown. As example the equipment was used to produce samples for Vickers microhardness measurement of important phases of the Au-Sn system. The measured values are comparable to those found in the literature. An outlook to further research is also given.

Original language	English
Title of host publication	Proceedings of the 9th IEEE Electronics Packaging Technology Conference
Publisher	IEEE
Publication date	2007
ISBN (Print)	978-1-4244-1323-2
DOIs	https://doi.org/10.1109/EPTC.2007.4469822
Publication status	Published - 2007
Event	2007 9th Electronics Packaging Technology Conference - , Singapore Duration: 10 Dec 2007 → 12 Dec 2007 Conference number: 9 https://ieeexplore.ieee.org/xpl/conhome/4455348/proceeding

Conference

Conference	2007 9th Electronics Packaging Technology Conference
Number	9
Country/Territory	Singapore
Period	10/12/2007 → 12/12/2007
Internet address	https://ieeexplore.ieee.org/xpl/conhome/4455348/proceeding

Bibliographical note

Copyright: 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

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@inproceedings{02eec3b95e4d4bcda79468e1180837c1,

title = "In-situ Investigation of Lead-free Solder Alloy Formation Using a Hot-plate Microscope",

abstract = "This work presents the advantages of using a hot-plate microscope for investigation of new (high-temperature) lead- free solders as in-situ analysis tool and preparation equipment. A description of the equipment and the preparation method is given and some examples are outlined. The formation of small AuSn-based, homogeneous and un-oxidized solder spheres will be demonstrated. Moreover the possibility of using this equipment as a sample preparation method to further investigation is shown. As example the equipment was used to produce samples for Vickers microhardness measurement of important phases of the Au-Sn system. The measured values are comparable to those found in the literature. An outlook to further research is also given.",

author = "Ren{\'e} Bergmann and Tang, {Peter Torben} and Hansen, {Hans N{\o}rgaard} and Per M{\o}ller",

note = "Copyright: 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE; 2007 9th Electronics Packaging Technology Conference, EPTC 2007 ; Conference date: 10-12-2007 Through 12-12-2007",

year = "2007",

doi = "10.1109/EPTC.2007.4469822",

language = "English",

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AU - Bergmann, René

AU - Tang, Peter Torben

AU - Hansen, Hans Nørgaard

AU - Møller, Per

N1 - Conference code: 9

PY - 2007

Y1 - 2007

N2 - This work presents the advantages of using a hot-plate microscope for investigation of new (high-temperature) lead- free solders as in-situ analysis tool and preparation equipment. A description of the equipment and the preparation method is given and some examples are outlined. The formation of small AuSn-based, homogeneous and un-oxidized solder spheres will be demonstrated. Moreover the possibility of using this equipment as a sample preparation method to further investigation is shown. As example the equipment was used to produce samples for Vickers microhardness measurement of important phases of the Au-Sn system. The measured values are comparable to those found in the literature. An outlook to further research is also given.

AB - This work presents the advantages of using a hot-plate microscope for investigation of new (high-temperature) lead- free solders as in-situ analysis tool and preparation equipment. A description of the equipment and the preparation method is given and some examples are outlined. The formation of small AuSn-based, homogeneous and un-oxidized solder spheres will be demonstrated. Moreover the possibility of using this equipment as a sample preparation method to further investigation is shown. As example the equipment was used to produce samples for Vickers microhardness measurement of important phases of the Au-Sn system. The measured values are comparable to those found in the literature. An outlook to further research is also given.

U2 - 10.1109/EPTC.2007.4469822

DO - 10.1109/EPTC.2007.4469822

M3 - Article in proceedings

SN - 978-1-4244-1323-2

BT - Proceedings of the 9th IEEE Electronics Packaging Technology Conference

PB - IEEE

T2 - 2007 9th Electronics Packaging Technology Conference

Y2 - 10 December 2007 through 12 December 2007

ER -

In-situ Investigation of Lead-free Solder Alloy Formation Using a Hot-plate Microscope

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