In-process monitoring of selective thermoplastic electrophotographic process by laser profiling system and digital fingerprint

Shuo Shan*, Hao Ping Yeh, Marta Rotari, Kenneth Ælkær Meinert, Jesper Henri Hattel, David Bue Pedersen, Murat Kulahci, Hans Nørgaard Hansen, Yang Zhang, Matteo Calaon

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsResearchpeer-review

Abstract

In the past decade, the demand for high-volume production of high-precision products with complex shapes has led to the development of new manufacturing processes. Among these processes, the Selective Thermoplastic Electrophotographic Process (STEP) shows potential for meeting these production demands. STEP involves layer-wise construction of a 3D object from a CAD model. However, during process characterization and optimization, defects such as dimensional flaws have been detected in the final products. To address this quality control issue, a laser profiling system has been installed on the STEP machine to detect process stability for every layer added to the 3D bulk. Additionally, finger print test structures have been introduced in the build job to evaluate process performance. Image detection post-processing of the test geometries is carried out to quantify the dynamic dimensional conformance layer by layer of the manufactured component. By using the online data collected through this quality control process, greater control over the manufacturing process can be achieved, and a feedback loop can be established. This feedback loop will allow for the online adjustment of manufacturing parameters, which will be applicable and provide great help for product optimization. The new sensors and algorithms used for this quality control process will also be incorporated into the digital twin, making this technology even more valuable for a wide range of applications.

Original languageEnglish
Title of host publicationEuropean Society for Precision Engineering and Nanotechnology, Conference Proceedings : 23rd International Conference and Exhibition, EUSPEN 2023
EditorsO. Riemer, C. Nisbet, D. Phillips
Publishereuspen
Publication date2023
Pages181-182
ISBN (Electronic)978-199899913-2
Publication statusPublished - 2023
Event23rd International Conference of the European Society for Precision Engineering and Nanotechnology - Copenhagen, Denmark, Copenhagen, Denmark
Duration: 12 Jun 202316 Jun 2023

Conference

Conference23rd International Conference of the European Society for Precision Engineering and Nanotechnology
LocationCopenhagen, Denmark
Country/TerritoryDenmark
CityCopenhagen
Period12/06/202316/06/2023

Keywords

  • 3D scanning
  • Additive manufacturing
  • Object detection
  • Process sensing technologies

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