Improving intrinsic corrosion reliability of printed circuit board assembly

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Abstract

    Corrosion reliability is a serious issue today for electronic devices, components, and bare printed circuit boards (PCBs) due to factors such as miniaturization, globalized manufacturing practices, and global usage. Electronic components and devices are exposed to a wide variety of climatic conditions, therefore the protection of electronic devices is becoming a critical factor in system design. Humidity and local condensation inside electronic enclosures can significantly alter the performance of electronic devices. The presence of moisture in a PCB alters its quality, functionality, thermal performance, and thermo-mechanical properties, while condensation on the surface of printed circuit board assemblies (PCBAs) can lead to electrical failures, like electrochemical migration. The result is reduced life span for electronic products and heavy economic loss due to failures.
    Original languageEnglish
    Title of host publicationProceedings of the 18th Electronics Packaging and Technology Conference (EPTC)
    PublisherIEEE
    Publication date2016
    Pages540-544
    ISBN (Electronic)978-1-5090-4369-9
    DOIs
    Publication statusPublished - 2016
    Event18th Electronics Packaging Technology Conference (EPTC) - The Suntec Singapore Convention & Exhibition Centre, Singapore, Singapore
    Duration: 30 Nov 20163 Dec 2016

    Conference

    Conference18th Electronics Packaging Technology Conference (EPTC)
    LocationThe Suntec Singapore Convention & Exhibition Centre
    Country/TerritorySingapore
    CitySingapore
    Period30/11/201603/12/2016

    Fingerprint

    Dive into the research topics of 'Improving intrinsic corrosion reliability of printed circuit board assembly'. Together they form a unique fingerprint.

    Cite this