Improving intrinsic corrosion reliability of printed circuit board assembly

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

Corrosion reliability is a serious issue today for electronic devices, components, and bare printed circuit boards (PCBs) due to factors such as miniaturization, globalized manufacturing practices, and global usage. Electronic components and devices are exposed to a wide variety of climatic conditions, therefore the protection of electronic devices is becoming a critical factor in system design. Humidity and local condensation inside electronic enclosures can significantly alter the performance of electronic devices. The presence of moisture in a PCB alters its quality, functionality, thermal performance, and thermo-mechanical properties, while condensation on the surface of printed circuit board assemblies (PCBAs) can lead to electrical failures, like electrochemical migration. The result is reduced life span for electronic products and heavy economic loss due to failures.
Original languageEnglish
Title of host publicationProceedings of the 18th Electronics Packaging and Technology Conference (EPTC)
PublisherIEEE
Publication date2016
Pages540-544
ISBN (Electronic)978-1-5090-4369-9
DOIs
Publication statusPublished - 2016
Event18th Electronics Packaging Technology Conference (EPTC) - The Suntec Singapore Convention & Exhibition Centre, Singapore, Singapore
Duration: 30 Nov 20163 Dec 2016

Conference

Conference18th Electronics Packaging Technology Conference (EPTC)
LocationThe Suntec Singapore Convention & Exhibition Centre
CountrySingapore
CitySingapore
Period30/11/201603/12/2016

Cite this

Ambat, R., & Conseil, H. (2016). Improving intrinsic corrosion reliability of printed circuit board assembly. In Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC) (pp. 540-544). IEEE. https://doi.org/10.1109/EPTC.2016.7861538