Improving intrinsic corrosion reliability of printed circuit board assembly

Rajan Ambat; Helene Conseil

doi:10.1109/EPTC.2016.7861538

Improving intrinsic corrosion reliability of printed circuit board assembly

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Abstract

Corrosion reliability is a serious issue today for electronic devices, components, and bare printed circuit boards (PCBs) due to factors such as miniaturization, globalized manufacturing practices, and global usage. Electronic components and devices are exposed to a wide variety of climatic conditions, therefore the protection of electronic devices is becoming a critical factor in system design. Humidity and local condensation inside electronic enclosures can significantly alter the performance of electronic devices. The presence of moisture in a PCB alters its quality, functionality, thermal performance, and thermo-mechanical properties, while condensation on the surface of printed circuit board assemblies (PCBAs) can lead to electrical failures, like electrochemical migration. The result is reduced life span for electronic products and heavy economic loss due to failures.

Original language	English
Title of host publication	Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC)
Publisher	IEEE
Publication date	2016
Pages	540-544
ISBN (Electronic)	978-1-5090-4369-9
DOIs	https://doi.org/10.1109/EPTC.2016.7861538
Publication status	Published - 2016
Event	18th Electronics Packaging Technology Conference (EPTC) - The Suntec Singapore Convention & Exhibition Centre, Singapore, Singapore Duration: 30 Nov 2016 → 3 Dec 2016

Conference

Conference	18th Electronics Packaging Technology Conference (EPTC)
Location	The Suntec Singapore Convention & Exhibition Centre
Country/Territory	Singapore
City	Singapore
Period	30/11/2016 → 03/12/2016

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10.1109/EPTC.2016.7861538

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title = "Improving intrinsic corrosion reliability of printed circuit board assembly",

abstract = "Corrosion reliability is a serious issue today for electronic devices, components, and bare printed circuit boards (PCBs) due to factors such as miniaturization, globalized manufacturing practices, and global usage. Electronic components and devices are exposed to a wide variety of climatic conditions, therefore the protection of electronic devices is becoming a critical factor in system design. Humidity and local condensation inside electronic enclosures can significantly alter the performance of electronic devices. The presence of moisture in a PCB alters its quality, functionality, thermal performance, and thermo-mechanical properties, while condensation on the surface of printed circuit board assemblies (PCBAs) can lead to electrical failures, like electrochemical migration. The result is reduced life span for electronic products and heavy economic loss due to failures.",

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AU - Conseil, Helene

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AB - Corrosion reliability is a serious issue today for electronic devices, components, and bare printed circuit boards (PCBs) due to factors such as miniaturization, globalized manufacturing practices, and global usage. Electronic components and devices are exposed to a wide variety of climatic conditions, therefore the protection of electronic devices is becoming a critical factor in system design. Humidity and local condensation inside electronic enclosures can significantly alter the performance of electronic devices. The presence of moisture in a PCB alters its quality, functionality, thermal performance, and thermo-mechanical properties, while condensation on the surface of printed circuit board assemblies (PCBAs) can lead to electrical failures, like electrochemical migration. The result is reduced life span for electronic products and heavy economic loss due to failures.

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PB - IEEE

T2 - 18th Electronics Packaging Technology Conference (EPTC)

Y2 - 30 November 2016 through 3 December 2016

ER -

Improving intrinsic corrosion reliability of printed circuit board assembly

Abstract

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