Abstract
It is shown that the sheath evolving to a negatively biased wafer during the plasma immersed ion implantation focuses the positive ions to distinct regions on the surface resulting in a poor uniformity of the ion dose. The focusing mechanism is investigated and solutions to improve the ion dose uniformity are proposed based on three-dimensional calculations of the potential distribution and ion trajectories within the sheath structure. Simulations are confirmed at lower scale in a DC Ar plasma which allows an easier visualization of the focusing phenomenon simultaneously with the measurement of the involved currents.
| Original language | English |
|---|---|
| Journal | Thin Solid Films |
| Volume | 506-507 |
| Pages (from-to) | 571-574 |
| ISSN | 0040-6090 |
| DOIs | |
| Publication status | Published - 2006 |
| Externally published | Yes |
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