Stacking of solid oxide cells (SOC) requires that a robust and durable electrical contact between the cell and the interconnect is established. In this work we present a new contact layer solution for the SOC air side, based on the concept of reactive oxidative bonding. The contact layer consists of metallic Mn-Co and Mn-Cu particles that during initiation/operation are oxidized in-situ to form well-conductive spinel oxides. The long-term (3000 h) stability of the new contact layers is evaluated by measuring the area specific resistance (ASR) during aging in air at 750 °C, and during thermal cycling. Both Mn-Co and Mn-Cu layers are found to be well compatible with the applied CeCo coated 441 steel, and do not significantly contribute to the resistance across the stack element, which is dominated by the coated steel.