Impact of Process-Related Flux Contamination on the Electronics Reliability Issues Under Detrimental Climatic Conditions

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

The reliability issues faced by modern electronic devices are inherently related to the non-optimized manufacturing process, which leaves behind a substantial amount of soldering residues of an aggressive nature. The use of flux systems for soldering purposes is vital, however, upon exposure of the device to harsh climatic conditions, it can result in the compromised corrosion reliability of the Printed Circuit Board Assembly (PCBA) due to the corrosive nature of the flux system. In this paper, the behavior of reflow process-related solder flux residues was investigated. The evolutions of potentially corrosive flux components from the soldered pads exposed to high humidity and temperature conditions was studied as a function of exposure climate and solder paste type using the acidity indication gel test. Changes in the filmformer morphology due to the climatic exposure were visualized using light optical and scanning electron microscopy, and correlated to the observations from the gel test. Quantification of the residue level was performed using the conductivity measurements. Results show that evolution of acidic residues from the reflow-soldered pads occurs upon exposure to high temperature and humidity levels. The exposure time defines the extent of evolution, and it was found to be typically directly proportional.
Original languageEnglish
Title of host publicationProceedings of the SMTA Pan Pacific Microelectronics Symposium 2019
Number of pages8
PublisherIEEE
Publication date2019
ISBN (Electronic)978-1-9445-4309-9 , 978-1-7281-3629-5
DOIs
Publication statusPublished - 2019
Event2019 Pan Pacific Microelectronics Symposium (Pan Pacific) - Kauai, United States
Duration: 11 Feb 201914 Feb 2019

Conference

Conference2019 Pan Pacific Microelectronics Symposium (Pan Pacific)
CountryUnited States
CityKauai
Period11/02/201914/02/2019

Keywords

  • Climatic reliability
  • Corrosion
  • Humidity
  • Quality
  • Residues
  • Solder flux

Cite this

@inproceedings{7f082e4b4e3a480bb47d16266b384acb,
title = "Impact of Process-Related Flux Contamination on the Electronics Reliability Issues Under Detrimental Climatic Conditions",
abstract = "The reliability issues faced by modern electronic devices are inherently related to the non-optimized manufacturing process, which leaves behind a substantial amount of soldering residues of an aggressive nature. The use of flux systems for soldering purposes is vital, however, upon exposure of the device to harsh climatic conditions, it can result in the compromised corrosion reliability of the Printed Circuit Board Assembly (PCBA) due to the corrosive nature of the flux system. In this paper, the behavior of reflow process-related solder flux residues was investigated. The evolutions of potentially corrosive flux components from the soldered pads exposed to high humidity and temperature conditions was studied as a function of exposure climate and solder paste type using the acidity indication gel test. Changes in the filmformer morphology due to the climatic exposure were visualized using light optical and scanning electron microscopy, and correlated to the observations from the gel test. Quantification of the residue level was performed using the conductivity measurements. Results show that evolution of acidic residues from the reflow-soldered pads occurs upon exposure to high temperature and humidity levels. The exposure time defines the extent of evolution, and it was found to be typically directly proportional.",
keywords = "Climatic reliability, Corrosion, Humidity, Quality, Residues, Solder flux",
author = "Kamila Piotrowska and Simone Lagana and Jellesen, {Morten S.} and Rajan Ambat",
year = "2019",
doi = "10.23919/PanPacific.2019.8696890",
language = "English",
booktitle = "Proceedings of the SMTA Pan Pacific Microelectronics Symposium 2019",
publisher = "IEEE",
address = "United States",

}

Piotrowska, K, Lagana, S, Jellesen, MS & Ambat, R 2019, Impact of Process-Related Flux Contamination on the Electronics Reliability Issues Under Detrimental Climatic Conditions. in Proceedings of the SMTA Pan Pacific Microelectronics Symposium 2019. IEEE, 2019 Pan Pacific Microelectronics Symposium (Pan Pacific), Kauai, United States, 11/02/2019. https://doi.org/10.23919/PanPacific.2019.8696890

Impact of Process-Related Flux Contamination on the Electronics Reliability Issues Under Detrimental Climatic Conditions. / Piotrowska, Kamila; Lagana, Simone; Jellesen, Morten S.; Ambat, Rajan.

Proceedings of the SMTA Pan Pacific Microelectronics Symposium 2019. IEEE, 2019.

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

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N2 - The reliability issues faced by modern electronic devices are inherently related to the non-optimized manufacturing process, which leaves behind a substantial amount of soldering residues of an aggressive nature. The use of flux systems for soldering purposes is vital, however, upon exposure of the device to harsh climatic conditions, it can result in the compromised corrosion reliability of the Printed Circuit Board Assembly (PCBA) due to the corrosive nature of the flux system. In this paper, the behavior of reflow process-related solder flux residues was investigated. The evolutions of potentially corrosive flux components from the soldered pads exposed to high humidity and temperature conditions was studied as a function of exposure climate and solder paste type using the acidity indication gel test. Changes in the filmformer morphology due to the climatic exposure were visualized using light optical and scanning electron microscopy, and correlated to the observations from the gel test. Quantification of the residue level was performed using the conductivity measurements. Results show that evolution of acidic residues from the reflow-soldered pads occurs upon exposure to high temperature and humidity levels. The exposure time defines the extent of evolution, and it was found to be typically directly proportional.

AB - The reliability issues faced by modern electronic devices are inherently related to the non-optimized manufacturing process, which leaves behind a substantial amount of soldering residues of an aggressive nature. The use of flux systems for soldering purposes is vital, however, upon exposure of the device to harsh climatic conditions, it can result in the compromised corrosion reliability of the Printed Circuit Board Assembly (PCBA) due to the corrosive nature of the flux system. In this paper, the behavior of reflow process-related solder flux residues was investigated. The evolutions of potentially corrosive flux components from the soldered pads exposed to high humidity and temperature conditions was studied as a function of exposure climate and solder paste type using the acidity indication gel test. Changes in the filmformer morphology due to the climatic exposure were visualized using light optical and scanning electron microscopy, and correlated to the observations from the gel test. Quantification of the residue level was performed using the conductivity measurements. Results show that evolution of acidic residues from the reflow-soldered pads occurs upon exposure to high temperature and humidity levels. The exposure time defines the extent of evolution, and it was found to be typically directly proportional.

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