Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Helene Conseil; Zygimantas Staliulionis; Morten Stendahl Jellesen; Mirmasoud Jabbaribehnam; Jesper Henri Hattel; Rajan Ambat

doi:10.1109/TCPMT.2017.2655447

Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Helene Conseil, Zygimantas Staliulionis, Morten Stendahl Jellesen, Mirmasoud Jabbaribehnam, Jesper Henri Hattel, Rajan Ambat

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Abstract

Electronic components and devices are exposed to a wide variety of climatic conditions, therefore the protection of electronic devices from humidity is becoming a critical factor in the system design. The ingress of moisture into typical electronic enclosures has been studied with defined parameters such as openings in the enclosure (drain holes, intentional openings or leak) and sealing and casing material. Related corrosion reliability issues due to humidity buildup have been evaluated using an interdigitated surface insulation resistance pattern placed inside the enclosure during exposure. The moisture buildup inside the enclosure has been simulated using an equivalent RC circuit consisting of variables like controlled resistors and capacitors to describe the diffusivity, permeability, and storage in polymers.

Original language	English
Journal	I E E E Transactions on Components, Packaging and Manufacturing Technology
Volume	7
Issue number	3
Pages (from-to)	412 - 423
ISSN	2156-3950
DOIs	https://doi.org/10.1109/TCPMT.2017.2655447
Publication status	Published - 2017

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10.1109/TCPMT.2017.2655447

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@article{c11df22d25c14e578c547ee19542f4fc,

title = "Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions",

abstract = "Electronic components and devices are exposed to a wide variety of climatic conditions, therefore the protection of electronic devices from humidity is becoming a critical factor in the system design. The ingress of moisture into typical electronic enclosures has been studied with defined parameters such as openings in the enclosure (drain holes, intentional openings or leak) and sealing and casing material. Related corrosion reliability issues due to humidity buildup have been evaluated using an interdigitated surface insulation resistance pattern placed inside the enclosure during exposure. The moisture buildup inside the enclosure has been simulated using an equivalent RC circuit consisting of variables like controlled resistors and capacitors to describe the diffusivity, permeability, and storage in polymers.",

author = "Helene Conseil and Zygimantas Staliulionis and Jellesen, {Morten Stendahl} and Mirmasoud Jabbaribehnam and Hattel, {Jesper Henri} and Rajan Ambat",

year = "2017",

doi = "10.1109/TCPMT.2017.2655447",

language = "English",

volume = "7",

pages = "412 -- 423",

journal = "I E E E Transactions on Components, Packaging and Manufacturing Technology",

issn = "2156-3950",

publisher = "Institute of Electrical and Electronics Engineers",

number = "3",

}

TY - JOUR

T1 - Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

AU - Conseil, Helene

AU - Staliulionis, Zygimantas

AU - Jellesen, Morten Stendahl

AU - Jabbaribehnam, Mirmasoud

AU - Hattel, Jesper Henri

AU - Ambat, Rajan

PY - 2017

Y1 - 2017

N2 - Electronic components and devices are exposed to a wide variety of climatic conditions, therefore the protection of electronic devices from humidity is becoming a critical factor in the system design. The ingress of moisture into typical electronic enclosures has been studied with defined parameters such as openings in the enclosure (drain holes, intentional openings or leak) and sealing and casing material. Related corrosion reliability issues due to humidity buildup have been evaluated using an interdigitated surface insulation resistance pattern placed inside the enclosure during exposure. The moisture buildup inside the enclosure has been simulated using an equivalent RC circuit consisting of variables like controlled resistors and capacitors to describe the diffusivity, permeability, and storage in polymers.

AB - Electronic components and devices are exposed to a wide variety of climatic conditions, therefore the protection of electronic devices from humidity is becoming a critical factor in the system design. The ingress of moisture into typical electronic enclosures has been studied with defined parameters such as openings in the enclosure (drain holes, intentional openings or leak) and sealing and casing material. Related corrosion reliability issues due to humidity buildup have been evaluated using an interdigitated surface insulation resistance pattern placed inside the enclosure during exposure. The moisture buildup inside the enclosure has been simulated using an equivalent RC circuit consisting of variables like controlled resistors and capacitors to describe the diffusivity, permeability, and storage in polymers.

U2 - 10.1109/TCPMT.2017.2655447

DO - 10.1109/TCPMT.2017.2655447

M3 - Journal article

SN - 2156-3950

VL - 7

SP - 412

EP - 423

JO - I E E E Transactions on Components, Packaging and Manufacturing Technology

JF - I E E E Transactions on Components, Packaging and Manufacturing Technology

IS - 3

ER -

Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

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